Patents by Inventor Yongkao GONG

Yongkao GONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Array substrate, display panel and display device
    Patent number: 11841589
    Abstract: Disclosed are an array substrate, a display panel and a display device. The array substrate includes a display area and a non-display area, the non-display area is provided around an outside of the display area, the non-display area is provided with a frame adhesive coating area, the frame adhesive coating area has a frame adhesive coating section, the array substrate further includes a metal pad provided within the frame adhesive coating section and electrically connected to a conductive metal ball, and the metal pad has a shape adapted to a shape of the frame adhesive coating section and extends in an extension direction of the frame adhesive coating section. The array substrate of the technical solution in the present application can ensure good conductivity and reduce the risk of circuit failure.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: December 12, 2023
    Assignee: HKC CORPORATION LIMITED
    Inventors: Yongkao Gong, Haoxuan Zheng
  • ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
    Publication number: 20230103252
    Abstract: Disclosed are an array substrate, a display panel and a display device. The array substrate includes a display area and a non-display area, the non-display area is provided around an outside of the display area, the non-display area is provided with a frame adhesive coating area, the frame adhesive coating area has a frame adhesive coating section, the array substrate further includes a metal pad provided within the frame adhesive coating section and electrically connected to a conductive metal ball, and the metal pad has a shape adapted to a shape of the frame adhesive coating section and extends in an extension direction of the frame adhesive coating section. The array substrate of the technical solution in the present application can ensure good conductivity and reduce the risk of circuit failure.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 30, 2023
    Applicant: HKC CORPORATION LIMITED
    Inventors: Yongkao GONG, Haoxuan ZHENG