Patents by Inventor Yongkun SUI

Yongkun SUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077446
    Abstract: A capacitive soil moisture sensor for detecting moisture levels in soil comprises a biodegradable substrate. A capacitive circuit is positioned on the biodegradable substrate. An antenna circuit is configured to communicate capacitance data. A hydrophobic, biodegradable encapsulating material encases at least the capacitive circuit.
    Type: Application
    Filed: January 27, 2022
    Publication date: March 7, 2024
    Inventors: Yongkun SUI, Madhur Bharath ATREYA, Gregory Lewis WHITING, Jenna NIELSON
  • Patent number: 11230132
    Abstract: A method for directly writing metal traces on a wide range of substrate materials is disclosed. The method includes writing a pattern of particle-free metal-salt-based ink on the substrate followed by a plasma-based treatment to remove the non-metallic components of the ink and decompose its metal salt into pure metal. The ink is based on a multi-part solvent whose components differ in at least one of evaporation rate, surface tension, and viscosity, which improves the manner in which the ink is converted into its metal constituent via the plasma treatment. In some embodiments, a microplasma is used for post-treatment of the deposited ink, where the plasma properties are controlled to provide different material properties, such as porosity and effective resistivity, in different regions of the metal pattern.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: January 25, 2022
    Assignees: Case Western Reserve University, THE UNITED STATES GOVERNMENT AS REPRESENTED BY THE UNITED STATES DEPARTMENT OF VETERANS AFFAIRS
    Inventors: Christopher J. Miller, Souvik Ghosh, Yongkun Sui, R. Mohan Sankaran, Christian A. Zorman
  • Publication number: 20180297387
    Abstract: A method for directly writing metal traces on a wide range of substrate materials is disclosed. The method includes writing a pattern of particle-free metal-salt-based ink on the substrate followed by a plasma-based treatment to remove the non-metallic components of the ink and decompose its metal salt into pure metal. The ink is based on a multi-part solvent whose components differ in at least one of evaporation rate, surface tension, and viscosity, which improves the manner in which the ink is converted into its metal constituent via the plasma treatment. In some embodiments, a microplasma is used for post-treatment of the deposited ink, where the plasma properties are controlled to provide different material properties, such as porosity and effective resistivity, in different regions of the metal pattern.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 18, 2018
    Inventors: Christopher J. MILLER, Souvik GHOSH, Yongkun SUI, R. Mohan SANKARAN, Christian A. ZORMAN