Abstract: A method for manufacturing a side wire for a substrate and a substrate structure are provided. The method includes: forming a plurality of first pattern structures on a side surface of the substrate, wherein a gap between any adjacent two of the plurality of first pattern structures connects a top surface and a bottom surface of the substrate to each other; forming a conductive material film covering the side surface of the substrate; and removing the plurality of first pattern structures and a portion of the conductive material film that is attached on the plurality of first pattern structures, and maintaining a portion of the conductive material film that is located between any adjacent two of the plurality of first pattern structures as the side wire.

Abstract: This invention discloses a method for mesh restoration, which includes the steps of: a) reserving channel resource for restoration path in the link by which the path passes and assigning discriminator for each channel, and determining the associated signaling channels for transporting the discriminator; b) when detecting the work path fails, activating the restoration path of the work path according to the discriminator which is transported by the associated signaling channel and whose value corresponds to a restoration. Using the method of the invention, the problem in rapid mesh restoration can be solved, and the speed of mesh restoration is comparable to that of the ring network protection.