Patents by Inventor Yonglin Liu

Yonglin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240014558
    Abstract: The present disclosure discloses an antenna apparatus and an electronic device, relating to the technical field of antennas. The antenna apparatus includes a circuit board, a first coil, and a light module. The first coil is provided on the circuit board. The light module is annularly provided on the circuit board along a circumferential direction of the first coil. For the antennal apparatus provided in the present disclosure, by providing the first coil on the circuit board, and meanwhile arranging the light module in a ring shape on the circuit board along the circumferential direction of the first coil, the light module and the first coil are respectively electrically connected to a motherboard of the electronic device, so that an operating state of the first coil is displayed by brightness or color of the light module.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 11, 2024
    Inventors: Kui Chen, Jieshan Li, Xi Sun, Yonglin Liu
  • Patent number: 8641798
    Abstract: A one-step process for synthesizing gold-copper bimetallic nanocubes. The process comprises the step of simultaneously reducing a copper II salt and a gold halide by 1,2-hexadecanediol in diphenyl ether, and 1-dodecanethiol as well as surfactants 1-adamantanecarboxylic acid and 1-hexadecylamine. The copper II salt may be copper (II) acetylacetonate, copper chloride, copper sulfate, or copper phosphate. The gold halide may be chloroauric acid, gold chloride, gold bromide, or tetrabromoauric acid. The reduction may occur at a temperature between about 160 and 180 degrees Celsius. The copper II salt may be copper (II) acetylacetonate and the gold halide may be chloroauric acid.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: February 4, 2014
    Assignee: The United States of America, as represented by the Secretary of Commerce, NIST
    Inventors: Angela R. Hight-Walker, Yonglin Liu
  • Publication number: 20110283834
    Abstract: A one-step process for synthesizing gold-copper bimetallic nanocubes. The process comprises the step of simultaneously reducing a copper II salt and a gold halide by 1,2-hexadecanediol in diphenyl ether, and 1-dodecanethiol as well as surfactants 1-adamantanecarboxylic acid and 1-hexadecylamine. The copper II salt may be copper (II) acetylacetonate, copper chloride, copper sulfate, or copper phosphate. The gold halide may be chloroauric acid, gold chloride, gold bromide, or tetrabromoauric acid. The reduction may occur at a temperature between about 160 and 180 degrees Celsius. The copper II salt may be copper (II) acetylacetonate and the gold halide may be chloroauric acid.
    Type: Application
    Filed: July 12, 2011
    Publication date: November 24, 2011
    Inventors: Angela R. Hight-Walker, Yonglin Liu