Patents by Inventor Yonglong Lin

Yonglong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230265492
    Abstract: The present invention relates to the field of biochips, and provides a surface linker for a semiconductor chip, a preparation method therefor and an application thereof. The chip surface linker reacts with a chip surface by means of using silanized molecules as a solute and toluene as a solvent so as to form bonding molecules connected to the chip surface, and is prepared by reacting with functionalized molecules to modify a hydroxyl group and an ester group. The chip surface linker obtained by the present invention may be stably bonded to the chip surface, is stable under acidic and alkaline conditions, has good electrical conductivity, electrical stability and resistance to organic solvents required for nucleic acid synthesis, and is extremely advantageous for subsequent nucleic acid.
    Type: Application
    Filed: July 27, 2021
    Publication date: August 24, 2023
    Applicant: Nanjing GenScript Biotech Co., Ltd.
    Inventors: Feichi Hu, Chunyan Liu, Cheng-Hsien Wu, Yonglong Lin