Abstract: Provided are an electrokinetic device and method for in-situ leaching of uranium, belonging to the technical field of in-situ leaching of uranium. The electrokinetic device for in-situ leaching of uranium includes an injection well, a pumping well, a positive electrode, a negative electrode, leaching solution, and a direct current power supply. Uranium ore is provided between the injection well and the pumping well, the negative electrode is arranged in the injection well, and the positive electrode is arranged in the pumping well. The leaching solution is injected from the injection well, flows through the uranium ore, and then is pumped from the pumping well for uranium extraction. The direct current power supply is respectively connected to the positive electrode and the negative electrode, and is configured to apply direct current between the positive electrode and the negative electrode to promote the pooling of uranium-carrying ions towards the pumping well.

Abstract: Heparin compounds and synthetic heparin analogues having short acting anticoagulant activity are provided. Methods of synthesizing such heparin compounds, including chemoenzymatic pathways using sulfotransferase enzymes are provided. Methods of treating subjects in need of anticoagulant activity are provided.

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

Abstract: In the field of biomedical technology, a PIWI-interacting RNA piR-hsa-211106 is used to prepare a targeted therapeutic drug for inhibiting proliferation of lung adenocarcinoma cells. A mechanism is as follows: after the PIWI-interacting RNA piR-hsa-211106 is constructed into an agonist or a transformant, the agonist or the transformant inhibits a tricarboxylic acid cycle process by down-regulating an expression of a pyruvate carboxylase, inhibits an energy metabolism, promotes apoptosis of the lung adenocarcinoma cells, thus inhibits growth of the lung adenocarcinoma. The PIWI-interacting RNA piR-hsa-211106 directly acts on a target site and does not produce toxic and side effects and an off-target phenomenon. Large amounts of analysis and in-vivo and in-vitro experiments show that the PIWI-interacting RNA piR-hsa-211106 has high credibility and a remarkable treatment effect, and provides a new research direction for anti-tumor therapy of lung adenocarcinoma.

Abstract: The present disclosure provides an adjuvant composition containing 0.2%-15% w/v carbomer, 0.1%-0.5% w/v lecithin, and 0.03%-0.2% w/v ginsenoside. The adjuvant composition of the present disclosure cannot only ensure the long-term clarification and/or stability of the vaccine, but also can effectively stimulate the inactivated antigens and subunit antigens therein to produce high-titer antibodies for immune protection. The inactivated vaccines or subunit vaccines prepared by the adjuvant composition of the present disclosure can be used as a diluent for freeze-dried live virus antigens and has no toxic effect on the live virus antigens.

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

Abstract: An embodiment provides a multi-time-scale Digital/Analog (D/A) hybrid simulation system and simulation method therefor for a complex power distribution network and a computer storage medium, and is intended to solve existing problems about multi-time-scale modeling and simulation of the complex power distribution network and simulation accuracy and efficiency of the complex power distribution network.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

Abstract: An embodiment provides a multi-time-scale Digital/Analog (D/A) hybrid simulation system and simulation method therefor for a complex power distribution network and a computer storage medium, and is intended to solve existing problems about multi-time-scale modeling and simulation of the complex power distribution network and simulation accuracy and efficiency of the complex power distribution network.

Abstract: Described herein are devices and techniques for measuring a thickness of a surface layer. A device can include a detector, a processor, and a memory. The detector can be arranged to receive reflected light from a surface of a sample. The processor can be in electrical communication with the detector. The memory can store instructions that, when executed by the processor, can cause the processor to perform operations. The operations can include receiving optical data from the detector, determining a polarization change of the reflected light, the polarization change being a function of the optical data, and determining a thickness of the surface layer using the polarization change and the wavelength of the incident light. The optical data can include information regarding the phase difference of the reflected light and the incident light. Also described are other embodiments.

Abstract: A method and machine may operate to fabricate a unitary, substantially uniformly distributed transfer material that can be coupled to a carrier material.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

Abstract: A method of fabricating a microelectronic package, a package fabricated according to the method, and a system including the package. The method comprises: providing a substrate and a die each having pre-solder bumps thereon; placing a patterned underfill film onto the substrate, the film having a filler therein, being substantially free of added flux and further defining a pattern of through-holes disposed such that corresponding pre-solder bumps of the substrate are exposed through the through-holes after placing the film; placing the die onto the substrate such that pre-solder bumps on the die contact corresponding pre-solder bumps on the substrate; forming solder joints from pre-solder bumps contacting one another; and after forming solder joints, solidifying the film to form the package.

Abstract: A method for finding rules and exceptions from a database uses four stages programmed into a computer, wherein the four stages include an adaptive stage for creating in accordance with a user's previously inputted specifications, a parameter file of rules and exceptions finding conditions in accordance with the user's specifications, with the file being displayed to the user; a data model stage for analyzing the parameters from the parameter file, and retrieving data from one or more databases in accordance with the parameters; a problem formulator stage for transforming the retrieved data into a formalized data structure compatible with the parameters, and creating a catalog of possible attributes; and a solving stage for generating rules and exceptions from the formalized data by using the parameters and the catalog, and sending the result to the adaptive stage.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

Abstract: A method for finding rules and exceptions from a database uses four stages programmed into a computer, wherein the four stages include an adaptive stage for creating in accordance with a user's previously inputted specifications, a parameter file of rules and exceptions finding conditions in accordance with the user's specifications, with the file being displayed to the user; a data model stage for analyzing the parameters from the parameter file, and retrieving data from one or more databases in accordance with the parameters; a problem formulator stage for transforming the retrieved data into a formalized data structure compatible with the parameters, and creating a catalog of possible attributes; and a solving stage for generating rules and exceptions from the formalized data by using the parameters and the catalog, and sending the result to the adaptive stage.