Abstract: A server cluster is described, which enables load balancing between servers in the cluster. At least some of the servers in the cluster are divided into a plurality of virtual servers, wherein each virtual server is associated with a neighbouring server, which neighbouring server acts as a backup for that virtual server. The neighbouring server of each virtual server of a particular server is part of a different physical server to the virtual server, such that in the event that a physical server is unavailable for use, the load of the virtual servers of that physical server is split between a number of different physical servers, thereby reducing the likelihood of overloading any particular physical server.

Abstract: An exemplary liquid crystal display (2) includes a liquid crystal panel (20) and a drive integrated circuit (IC) (21). The liquid crystal panel includes a plurality of circuit pads (202), a first positional mark (2031), and a second positional mark (2032). The drive IC includes a plurality of metal bumps (210) respectively electrically connected to the circuit pads of the liquid crystal panel, a first sideline (2131), and a second sideline (2132) oriented at an angle relative to the first sideline. A distance from the first positional mark to a nearest one of the circuit pads is equal to a distance from the first sideline to a nearest one of the metal bumps. A distance from the second positional mark to a nearest one of the circuit pads is equal to a distance from the second sideline to a nearest one of the metal bumps.

Abstract: An exemplary liquid crystal display (2) includes a liquid crystal panel (20) and a drive integrated circuit (IC) (21). The liquid crystal panel includes a plurality of circuit pads (202), a first positional mark (2031), and a second positional mark (2032). The drive IC includes a plurality of metal bumps (210) respectively electrically connected to the circuit pads of the liquid crystal panel, a first sideline (2131), and a second sideline (2132) oriented at an angle relative to the first sideline. A distance from the first positional mark to a nearest one of the circuit pads is equal to a distance from the first sideline to a nearest one of the metal bumps. A distance from the second positional mark to a nearest one of the circuit pads is equal to a distance from the second sideline to a nearest one of the metal bumps.