Patents by Inventor Yongnian QI

Yongnian QI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12104054
    Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: October 1, 2024
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Liexiang He, Yongnian Qi, Xianping Zeng, Zhongqiang Yang, Hualin Pan
  • Publication number: 20220153989
    Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
    Type: Application
    Filed: April 8, 2019
    Publication date: May 19, 2022
    Inventors: Liexiang HE, Yongnian QI, Xianping ZENG, Zhongqiang YANG, Hualin PAN