Abstract: This application provides a heat exchange device and a heat exchange system. The heat exchange device has a first heat exchange mode, and includes a housing, a partition plate, an evaporator, and a compressor. The partition plate divides space inside the housing into an internal circulation cavity and an external circulation cavity. The evaporator and the compressor are located in the internal circulation cavity. A first valve group is disposed between an inlet of the compressor and an outlet of the evaporator. When the first heat exchange mode is used for heat exchange, the evaporator is communicated with the compressor by using the first valve group. In this application, the compressor is disposed in the internal circulation cavity, so that a temperature difference between the compressor and the evaporator is small, thereby reducing a slugging risk of the compressor.

Abstract: An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.

Abstract: An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.

Abstract: A cooling device comprising a cooling circuit, is described. The cooling circuit further comprises a compressor adapted to compress cooling agent present in the cooling circuit during an active cooling mode, wherein the compressed cooling agent contains lubricant oil from the compressor; a condensing unit connected to the compressor by a first fluid line of the cooling circuit; and an evaporating unit, which is connected to the condensing unit by a second fluid line of the cooling circuit. The cooling circuit further comprises an expansion device arranged in the second fluid line; and an additional evaporator connected to the evaporating unit by a third fluid line of the cooling circuit, and connected to the compressor by a fourth fluid line of the cooling circuit.

Abstract: A temperature control cabinet includes at least one cabinet unit. Each cabinet unit includes: a subrack, where there is a placement space for placing a device inside the subrack, and there is at least one opening at a periphery of the cabinet; and a cabinet door mounted on the subrack and configured to buckle the opening, where at least two temperature control components are disposed on the cabinet door, the temperature control components are arranged in a first direction, the first direction is a direction from the top to the bottom of the subrack, each temperature control component is provided with an air exhaust vent and an air return vent, the air return vent of each temperature control component communicates with a hot area at the top of the placement space, and the air exhaust vent of each temperature control component communicates with the placement space.

Abstract: A cooling device comprising a cooling circuit, is described. The cooling circuit further comprises a compressor adapted to compress cooling agent present in the cooling circuit during an active cooling mode, wherein the compressed cooling agent contains lubricant oil from the compressor; a condensing unit connected to the compressor by a first fluid line of the cooling circuit; and an evaporating unit, which is connected to the condensing unit by a second fluid line of the cooling circuit. The cooling circuit further comprises an expansion device arranged in the second fluid line; and an additional evaporator connected to the evaporating unit by a third fluid line of the cooling circuit, and connected to the compressor by a fourth fluid line of the cooling circuit.

Abstract: The temperature control cabinet includes at least one cabinet unit. Each cabinet unit includes: a subrack, where there is a placement space for placing a device inside the subrack, and there is at least one opening at a periphery of the cabinet; and a cabinet door mounted on the subrack and configured to buckle the opening, where at least two temperature control components are disposed on the cabinet door, the temperature control components are arranged in a first direction, the first direction is a direction from the top to the bottom of the subrack, each temperature control component is provided with an air exhaust vent and an air return vent, the air return vent of each temperature control component is communicated with a hot area at the top of the placement space, and the air exhaust vent of each temperature control component is communicated with the placement space.