Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: A circuit and method for driving a magnetostriction oscillator which is used for generating a high output ultrasonic wave by using a pulse width modulation is provided. In the circuit, a controller outputs first and second variable digital signals in order to control a duty cycle of a magnetostriction oscillator. A pulse width modulating circuit generates a variable pulse width modulating signal based on the first and second variable digital signals from the controller. A driver drives the magnetostriction oscillator according to the variable pulse width modulating signal from the pulse width modulating circuit. According to the circuit, the system operates for a long time so that stability of equipment can be obtained. The circuit uses low voltage and low energy so that efficiency of the system is promoted.

Abstract: A piezoelectric device is used in an dual axial gyroscope system and includes a piezoelectric exciter for generating a linear velocity on a first axis; a first piezoelectric detector element, placed on a surface of the piezoelectric exciter in a direction orthogonal to the first axis, for detecting a first Coriolis force provided in a direction orthogonal to the first detector; and as second piezoelectric detector element, placed on the surface of the piezoelectric exciter in a direction orthogonal to the first axis and the first detector, for detecting a second Coriolis force provided in a direction orthogonal to the second detector element.