Patents by Inventor Yong Seon HWANG

Yong Seon HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for semiconductor package, and prepreg and metal clad laminate using the same
    Patent number: 10913849
    Abstract: A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: February 9, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Chang Bo Shim, Hee Yong Shim, Hyun Sung Min, Hwa Yeon Moon, Seung Hyun Song, Yong Seon Hwang
  • Thermosetting resin composition for semiconductor package and prepreg using the same
    Patent number: 10294341
    Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 21, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Hwa Yeon Moon, Yong Seon Hwang, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim, Young Chan Kim, Seung Hyun Song, Won Ki Kim
  • Thermosetting resin composition for semiconductor package and prepreg using the same
    Publication number: 20180148555
    Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.
    Type: Application
    Filed: December 28, 2016
    Publication date: May 31, 2018
    Inventors: Hwa Yeon MOON, Yong Seon HWANG, Hee Yong SHIM, Hyun Sung MIN, Mi Seon KIM, Chang Bo SHIM, Young Chan KIM, Seung Hyun SONG, Won Ki KIM