Abstract: A vibration device, including a housing having accommodating space, a vibrator, a stator and an elastic member for making the vibrator suspended in the accommodating space, the vibrator, the stator and the elastic member are accommodated in the housing, one of the vibrator and the stator includes a magnetic circuit unit while the other one includes a coil, the housing includes a pair of first side walls symmetrically arranged in a long axis direction of the housing and a pair of second side walls symmetrically arranged in a short axis direction, the elastic member includes a sheet-like spring perpendicular to vibrating direction of the vibrator, the spring includes a first fixing portion fixedly connected with the housing, a second fixing portion fixedly connected with the vibrator, and an N-shaped connecting portion connects the first fixing portion with the second fixing portion and extends along the short axis direction.

Abstract: A vibration device, including a housing having accommodating space, a vibrator, a stator and an elastic member for making the vibrator suspended in the accommodating space, the vibrator, the stator and the elastic member are accommodated in the housing, one of the vibrator and the stator includes a magnetic circuit unit while the other one includes a coil, the housing includes a pair of first side walls symmetrically arranged in a long axis direction of the housing and a pair of second side walls symmetrically arranged in a short axis direction, the elastic member includes a sheet-like spring perpendicular to vibrating direction of the vibrator, the spring includes a first fixing portion fixedly connected with the housing, a second fixing portion fixedly connected with the vibrator, and an N-shaped connecting portion connects the first fixing portion with the second fixing portion and extends along the short axis direction.

Abstract: A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.

Abstract: A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.