Patents by Inventor Yongsheng Peng

Yongsheng Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240165430
    Abstract: Disclosed are an ultrasonic treatment tip and an ultrasonic therapeutic apparatus. The ultrasonic treatment tip is configured to connect the ultrasonic therapeutic apparatus, the ultrasonic treatment tip includes: an outer shell, a cover body, an inner shell, a heat dissipation structure, a sound-permeable membrane and a transducer, the outer shell is provided with a first port; the cover body covers the first port, the cover body and the outer shell are configured to limit an installation cavity, the cover body is provided with an avoidance hole connected to the installation cavity, and the cover body is connected to the ultrasonic treatment handle; the inner shell is provided at the installation cavity, the inner shell is provided with a receiving cavity for receiving an ultrasonic transmission medium, and the receiving cavity is provided with a second port.
    Type: Application
    Filed: January 26, 2024
    Publication date: May 23, 2024
    Applicant: SHENZHEN PENINSULA MEDICAL GROUP
    Inventors: Yujia PENG, Yongsheng LIANG, Yanan LI, Xiaobing LEI, Yi DING
  • Publication number: 20240102025
    Abstract: The present disclosure provides a gene combination for expressing and producing terrequinone A in Escherichia coli and use thereof. The gene combination includes a tdiAS gene, a tdiBS gene, a tdiCS gene, a tdiDS gene, a tdiES gene, an sfpS gene, an ScCKS gene, and an AtIPKS gene with nucleotide sequences set forth in SEQ ID NOS:1 to 8. In the present disclosure, a recombinant engineered strain capable of producing terrequinone A having anti-cancer activity is obtained by separately constructing recombinant plasmids pC02 and pU03 through the eight genes and transforming the two recombinant plasmids into E. coli. The content of terrequinone A in a fermentation broth thereof is 106.3 mg/L, which has potential application value in the biopharmaceutical field.
    Type: Application
    Filed: May 24, 2023
    Publication date: March 28, 2024
    Inventors: Yongsheng TIAN, Lijuan WANG, Yongdong DENG, Quanhong YAO, Rihe PENG, Jianjie GAO, Zhenjun LI, Wenhui ZHANG, Bo WANG, Jing XU, Yu WANG, Xiaoyan FU, Hongjuan HAN
  • Patent number: 11245178
    Abstract: A WIFI antenna, including: a dipole including a first radiator and a second radiator that are arranged opposite to and spaced apart from each other; a feeding port provided at adjacent ends of the first radiator and the second radiator; a balun structure including a first access portion, a second access portion provided opposite to the first access portion, and an intermediate portion connecting the first access portion with the second access portion, and the intermediate portion having an annular structure; the first access portion of the balun structure is connected to the first radiator at the feeding port, and the second access portion is connected to the second radiator at the feeding port. Setting of the WIFI antenna provides characteristics of omnidirectional radiation, high gain and high physical stability, which not only improves the gain, but also fully covers the WIFI frequency band.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: February 8, 2022
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Yachuan Shen, Lei Zheng, Yongsheng Peng, Hongjun Wang
  • Patent number: 11211717
    Abstract: Provided is a PCB antenna, including a PCB substrate, first and second radiating portions, the first radiating portion includes a first radiator, second and third radiators extending therefrom to form a feeding groove, and first and second openings provided on the second and third radiators; the second radiating portion includes a fourth radiator and fifth and sixth radiators extending therefrom, a seventh radiator and eighth and ninth radiators extending therefrom, tenth and eleventh radiators symmetrically extending from the fourth radiator to the seventh radiator; the tenth and eleventh radiators extend towards the first radiating portion to form twelfth and thirteenth radiators, and form third and fourth slots with the second and third radiators; the fifth radiator extends to the feeding groove. The PCB antenna provided by the present invention can enhance the medium and high frequency resonance and provide antenna design in a frequency band of 5G-Sub6G.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: December 28, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Yachuan Shen, Lei Zheng, Yongsheng Peng, Hongjun Wang
  • Patent number: 11196169
    Abstract: Provided is a PCB antenna, including PCB substrate, first and second radiating portions, the first radiating portion includes first radiator, second and third radiators extending therefrom to form feeding groove; the second radiating portion includes fourth radiator, fifth and sixth radiators extending therefrom, seventh radiator, eighth and ninth radiators extending therefrom, and tenth and eleventh radiators symmetrically arranged, the fifth radiator extends to the feeding groove; the sixth radiator extends in opposite direction of the fifth radiator; the seventh radiator extends in the direction of the sixth radiator and forms second slot therewith; the eighth radiator extends in opposite direction of the seventh radiator; third slot is formed between the tenth radiator and the second radiator, fourth slot is formed between the eleventh radiator and the third radiator.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: December 7, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Yachuan Shen, Lei Zheng, Yongsheng Peng, Hongjun Wang
  • Patent number: 11158932
    Abstract: The present invention discloses an antenna including a frame body and a circuit board arranged in the frame body. The frame body includes a middle frame and an outer metal frame surrounding the edge of the middle frame and connected to the middle frame. The outer metal frame includes a first side frame, a second side frame, a third side frame and a fourth side frame. The circuit board is provided with a feeding part and a switch circuit which are electrically connected with the third side frame. The third side frame and the middle frame are arranged at an interval to form a first gap; a second gap is arranged between one end of the second side frame near the third side frame and the middle frame. BY virtue of this configuration the radiation efficiency of the antenna is accordingly improved.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Yongsheng Peng, Lei Zheng
  • Patent number: 11056786
    Abstract: The present disclosure provides an antenna system including a non-metallic housing. The non-metallic housing includes a top edge portion, a bottom edge portion provided correspondingly to the top edge portion, and a first long side edge portion and a second long side edge portion that connect the top edge portion with the bottom edge portion. The antenna system further includes seven antenna units provided on a periphery of the non-metallic housing. Compared with the related art, the antenna system provided by the present disclosure, by providing seven antenna units on the periphery of the non-metallic housing, achieves 3.3-3.6 GHz-4×4 MIMO, WIFI-2×2 MIMO, GPS, and 2G, 3G and 4G mobile communications.
    Type: Grant
    Filed: July 28, 2019
    Date of Patent: July 6, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Yufei Zhu, Yongsheng Peng
  • Publication number: 20210021047
    Abstract: Provided is a PCB antenna, including PCB substrate, first and second radiating portions, the first radiating portion includes first radiator, second and third radiators extending therefrom to form feeding groove; the second radiating portion includes fourth radiator, fifth and sixth radiators extending therefrom, seventh radiator, eighth and ninth radiators extending therefrom, and tenth and eleventh radiators symmetrically arranged, the fifth radiator extends to the feeding groove; the sixth radiator extends in opposite direction of the fifth radiator; the seventh radiator extends in the direction of the sixth radiator and forms second slot therewith; the eighth radiator extends in opposite direction of the seventh radiator; third slot is formed between the tenth radiator and the second radiator, fourth slot is formed between the eleventh radiator and the third radiator.
    Type: Application
    Filed: August 3, 2020
    Publication date: January 21, 2021
    Inventors: Yachuan Shen, Lei Zheng, Yongsheng Peng, Hongjun Wang
  • Publication number: 20200412016
    Abstract: Provided is a PCB antenna, including a PCB substrate, first and second radiating portions, the first radiating portion includes a first radiator, second and third radiators extending therefrom to form a feeding groove, and first and second openings provided on the second and third radiators; the second radiating portion includes a fourth radiator and fifth and sixth radiators extending therefrom, a seventh radiator and eighth and ninth radiators extending therefrom, tenth and eleventh radiators symmetrically extending from the fourth radiator to the seventh radiator; the tenth and eleventh radiators extend towards the first radiating portion to form twelfth and thirteenth radiators, and form third and fourth slots with the second and third radiators; the fifth radiator extends to the feeding groove. The PCB antenna provided by the present invention can enhance the medium and high frequency resonance and provide antenna design in a frequency band of 5G-Sub6G.
    Type: Application
    Filed: August 3, 2020
    Publication date: December 31, 2020
    Inventors: Yachuan Shen, Lei Zheng, Yongsheng Peng, Hongjun Wang
  • Publication number: 20200411951
    Abstract: A WIFI antenna, including: a dipole including a first radiator and a second radiator that are arranged opposite to and spaced apart from each other; a feeding port provided at adjacent ends of the first radiator and the second radiator; a balun structure including a first access portion, a second access portion provided opposite to the first access portion, and an intermediate portion connecting the first access portion with the second access portion, and the intermediate portion having an annular structure; the first access portion of the balun structure is connected to the first radiator at the feeding port, and the second access portion is connected to the second radiator at the feeding port. Setting of the WIFI antenna provides characteristics of omnidirectional radiation, high gain and high physical stability, which not only improves the gain, but also fully covers the WIFI frequency band.
    Type: Application
    Filed: August 19, 2020
    Publication date: December 31, 2020
    Inventors: Yachuan Shen, Lei Zheng, Yongsheng Peng, Hongjun Wang
  • Publication number: 20200411956
    Abstract: The present invention discloses an antenna including a frame body and a circuit board arranged in the frame body. The frame body includes a middle frame and an outer metal frame surrounding the edge of the middle frame and connected to the middle frame. The outer metal frame includes a first side frame, a second side frame, a third side frame and a fourth side frame. The circuit board is provided with a feeding part and a switch circuit which are electrically connected with the third side frame. The third side frame and the middle frame are arranged at an interval to form a first gap; a second gap is arranged between one end of the second side frame near the third side frame and the middle frame. BY virtue of this configuration the radiation efficiency of the antenna is accordingly improved.
    Type: Application
    Filed: July 23, 2020
    Publication date: December 31, 2020
    Inventors: Yongsheng Peng, Lei Zheng
  • Publication number: 20200044339
    Abstract: The present disclosure provides an antenna system including a non-metallic housing. The non-metallic housing includes a top edge portion, a bottom edge portion provided correspondingly to the top edge portion, and a first long side edge portion and a second long side edge portion that connect the top edge portion with the bottom edge portion. The antenna system further includes seven antenna units provided on a periphery of the non-metallic housing. Compared with the related art, the antenna system provided by the present disclosure, by providing seven antenna units on the periphery of the non-metallic housing, achieves 3.3-3.6 GHz-4×4 MIMO, WIFI-2×2 MIMO, GPS, and 2G, 3G and 4G mobile communications.
    Type: Application
    Filed: July 28, 2019
    Publication date: February 6, 2020
    Inventors: Yufei Zhu, Yongsheng Peng
  • Patent number: 10530043
    Abstract: An antenna includes a metal frame including a radiation frame with a first grounding point, and a grounding frame separated from the radiation frame; a mainboard including a system ground and a feeding end, the system ground including a first and second ground point; a diversity antenna unit including a feeding point and a second grounding point; and a conductive bracket; a front-facing camera is mounted on the mainboard; a gap is between the radiation frame and the grounding frame, the first ground point and the second ground point are at two opposite sides of the camera, respectively; the feeding point is connected with the feeding end, the second grounding point is connected with the system ground; one end of the conductive bracket is connected with the first ground point, and the other end is connected with the second ground point, so that the conductive bracket crosses the camera.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: January 7, 2020
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Feng Liu, Jingqiang Luo, Yongsheng Peng
  • Publication number: 20180375195
    Abstract: An antenna includes a metal frame including a radiation frame with a first grounding point, and a grounding frame separated from the radiation frame; a mainboard including a system ground and a feeding end, the system ground including a first and second ground point; a diversity antenna unit including a feeding point and a second grounding point; and a conductive bracket; a front-facing camera is mounted on the mainboard; a gap is between the radiation frame and the grounding frame, the first ground point and the second ground point are at two opposite sides of the camera, respectively; the feeding point is connected with the feeding end, the second grounding point is connected with the system ground; one end of the conductive bracket is connected with the first ground point, and the other end is connected with the second ground point, so that the conductive bracket crosses the camera.
    Type: Application
    Filed: December 1, 2017
    Publication date: December 27, 2018
    Inventors: Feng Liu, Jingqiang Luo, Yongsheng Peng
  • Publication number: 20140254101
    Abstract: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components may be embedded into a copper core. In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate may be layered above and below the copper core. A copper ground plane may be fixed underneath the layer of PCB laminate below, and furthest from, the copper core. One or more additional components may be surface mounted on top of the PCB laminate layers above the copper core. A conformal coating may be applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating may include trenching and a copper sputter coating finish.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Mark A. CARTER, Yang ZHANG, Yongsheng PENG, Jack B. STEENSTRA, Michael G. BARRETT
  • Patent number: 8737080
    Abstract: A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: May 27, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Yang Zhang, Yongsheng Peng, Jack B. Steenstra
  • Publication number: 20120182699
    Abstract: A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.
    Type: Application
    Filed: January 14, 2011
    Publication date: July 19, 2012
    Applicant: QUALCOMM Incorporated
    Inventors: Yang Zhang, Yongsheng Peng, Jack B. Steenstra
  • Patent number: 6313698
    Abstract: A method and apparatus for RF amplification of a transmit signal within a wireless phone. The amplifier chain is composed of three parts, a pre-driver, a bypassable driver amp, and a power amp. The configuration of the amplifier chain is adjusted in real time to optimize power consumption for a given output power requirement. At low output power levels the driver amp is bypassed and the power amp is provided a low bias current. At medium output power levels the driver amp is bypassed and the power amp is biased at a moderate current. When high output power is required the driver amp is utilized and the power amp is provided a high bias current. The driver amp is shut down when in the bypassed state. The result of implementing this amplifier configuration is an increase in the efficiency of the transmit amplifier. The increase in amplifier efficiency results in increased talk times for battery powered wireless phones.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: November 6, 2001
    Assignee: Qualcomm Incorporated
    Inventors: Yang Zhang, Yongsheng Peng