Patents by Inventor Yong-sun SHIN

Yong-sun SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9115871
    Abstract: A backlight assembly includes first LED packages, second LED packages, a light guide plate, a printed circuit board, and a light blocking member. Each of the first LED packages emits light of a first color. Each of the second LED packages emits light of a second color different from the first color. The first and the second LED packages are provided in the same number and alternately arranged with each other. The light guide plate receives an incident light from the first and the second LED packages to output an emission light, and the first and second LED packages are mounted on the printed circuit board. In addition, the light blocking member blocks the light generated from one of the first LED packages, which is located at an outermost portion of the printed circuit board, and travelling to the light guide plate.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: August 25, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yong-sun Shin, Jinsoo Shin
  • Publication number: 20140049987
    Abstract: A backlight assembly includes first LED packages, second LED packages, a light guide plate, a printed circuit board, and a light blocking member. Each of the first LED packages emits light of a first color. Each of the second LED packages emits light of a second color different from the first color. The first and the second LED packages are provided in the same number and alternately arranged with each other. The light guide plate receives an incident light from the first and the second LED packages to output an emission light, and the first and second LED packages are mounted on the printed circuit board. In addition, the light blocking member blocks the light generated from one of the first LED packages, which is located at an outermost portion of the printed circuit board, and travelling to the light guide plate.
    Type: Application
    Filed: February 11, 2013
    Publication date: February 20, 2014
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yong-sun SHIN, JINSOO SHIN