Abstract: A pseudo-static test device and method for seismic behavior of connection joints of a wallboard. The device includes ground anchor holes, a support frame including a steel beam and two steel columns, and a test wallboard. A bottom plate of the steel beam is provided with at least two first connecting holes. A top plate each steel column is provided with a second connecting hole. A bottom plate of each steel column is provided with a third connecting hole. The bottom plate of the steel beam is provided with a connection joint assembly configured to hingedly or rigidly connect a top of the test wallboard to the steel beam. Each first connecting hole is connected to the second connecting hole through a flange assembly.

Abstract: A pseudo-static test device and method for seismic behavior of connection joints of a wallboard. The device includes ground anchor holes, a support frame including a steel beam and two steel columns, and a test wallboard. A bottom plate of the steel beam is provided with at least two first connecting holes. A top plate each steel column is provided with a second connecting hole. A bottom plate of each steel column is provided with a third connecting hole. The bottom plate of the steel beam is provided with a connection joint assembly configured to hingedly or rigidly connect a top of the test wallboard to the steel beam. Each first connecting hole is connected to the second connecting hole through a flange assembly.

Abstract: Provided is a recovery method for a copper-indium-gallium-selenium material, mainly comprising the steps of sulfuric acid aeration leaching at a high temperature, reducing selenium with sodium sulfite, separating copper by extracting, separating indium and gallium with an alkali, replacing indium, electrolyzing gallium, etc. In the recovery method for a copper-indium-gallium-selenium material, a sulfuric acid aeration leaching means is used, thus reducing acid gas pollution; at the same time, an extraction agent for copper is used to extract copper, wherein the separating effect is good and the cost is low, and the extracted copper is directly electrolyzed so as to obtain a high-purity metal copper; moreover, an alkali is used to separate gallium, wherein realizing the separation of indium and gallium only requires the adjustment of the pH value of a solution, the separating effect is good and the obtained indium and gallium products have a relatively high purity.

Abstract: A method for recycling copper indium gallium selenium materials comprises the steps of sulphating roasting, acid dissolution, extraction and electrolysis of metal copper, production of a gallium hydroxide deposition, replacement of indium, and the like.

Abstract: A method for recycling copper indium gallium selenium materials comprises the steps of leaching by using sulfuric acid and hydrogen peroxide, reduction of selenium by using sulfur dioxide, separation of copper by using hydrolysis, alkali separation of indium and gallium, replacement of indium, hydrolysis of gallium, and the like. Leaching is carried out by using sulfuric acid in cooperation with hydrogen peroxide, so that the leaching rate is greatly improved, and acid gas pollution is reduced; PH differential copper is separated by using metal ion hydrolysis, so that costs are low; and in addition, alkali separation of gallium is carried out, separation between indium and gallium can be implemented by merely adjusting the PH of a solution, the separation effect is good, the purities of obtained indium and gallium products are high.