Patents by Inventor Yongtao Li

Yongtao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8703591
    Abstract: A method for fabricating black silicon by using plasma immersion ion implantation is provided, which includes: putting a silicon wafer into a chamber of a black silicon fabrication apparatus; adjusting processing parameters of the black silicon fabrication apparatus to preset scales; generating plasmas in the chamber of the black silicon fabrication apparatus; implanting reactive ions among the plasmas into the silicon wafer, and forming the black silicon by means of the reaction of the reactive ions and the silicon wafer. The method can form the black silicon which has a strong light absorption property and is sensitive to light, and has advantages of high productivity, low cost and simple production process.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: April 22, 2014
    Assignee: The Institute of Microelectronics of Chinese Academy of Sciences
    Inventors: Yang Xia, Bangwu Liu, Chaobo Li, Jie Liu, Minggang Wang, Yongtao Li
  • Publication number: 20130072007
    Abstract: A method for fabricating black silicon by using plasma immersion ion implantation is provided, which includes: putting a silicon wafer into a chamber of a black silicon fabrication apparatus; adjusting processing parameters of the black silicon fabrication apparatus to preset scales; generating plasmas in the chamber of the black silicon fabrication apparatus; implanting reactive ions among the plasmas into the silicon wafer, and forming the black silicon by means of the reaction of the reactive ions and the silicon wafer. The method can form the black silicon which has a strong light absorption property and is sensitive to light, and has advantages of high productivity, low cost and simple production process.
    Type: Application
    Filed: July 26, 2010
    Publication date: March 21, 2013
    Applicant: The Institute of Microelectronics of Chinese Academy of Sciences
    Inventors: Yang Xia, Bangwu Liu, Chaobo Li, Jie Liu, Minggang Wang, Yongtao Li
  • Publication number: 20130068297
    Abstract: A black silicon solar cell includes a metal back electrode, the crystal silicon, a black silicon layer, a passivation layer and a metal gate; wherein, the metal back electrode is located on the back surface of the crystal silicon, the black silicon layer is located on the crystal silicon, the passivation layer is located on the black silicon layer, the metal gate is located on the passivation layer. The fabrication method includes: carrying out pretreatment of the silicon wafer; preparing the black silicon layer on the surface of the pretreated silicon wafer by using plasma immersion ion implantation technology; preparing an emitter on the black silicon layer, and carrying out passivation treatment on the emitter to form the passivation layer; respectively preparing the metal back electrode and the metal gate on the back surface of the single crystal silicon wafer and the passivation layer, respectively.
    Type: Application
    Filed: August 5, 2010
    Publication date: March 21, 2013
    Applicant: The Institute of Microelectronics of Chinese Acade Academy of Sciences
    Inventors: Yang Xia, Bangwu Liu, Chaobo Li, Jie Liu, Minggang Wang, Yongtao Li
  • Publication number: 20130071965
    Abstract: An in-situ fabrication method for a silicon solar cell includes the following steps: pretreating a silicon chip; placing the pretreated silicon chip in an implantation chamber of a plasma immersion ion implantation machine; completing the preparation of black silicon via a plasma immersion ion implantation process; making a PN junction and forming a passivation layer on the black silicon; after making the PN junction and forming the passivation layer, removing the black silicon from the plasma immersion ion implantation machine; preparing a metal back electrode on the back of the black silicon; preparing a metal grid on the passivation layer; obtaining a solar cell after encapsulation. Said method enables black silicon preparation, PN junction preparation, and passivation layer formation in-situ, greatly reducing the amount of equipment needed for the preparation of solar cells and the preparation cost. In addition, the method is simple and easy to control.
    Type: Application
    Filed: September 8, 2010
    Publication date: March 21, 2013
    Applicant: The Institute of Microelectronics of Chinese Academy of Sciences
    Inventors: Yang Xia, Bangwu Liu, Chaobo Li, Jie Liu, Minggang Wang, Yongtao Li