Patents by Inventor Yongwang Xiao
Yongwang Xiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240081026Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly, where the first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.Type: ApplicationFiled: November 9, 2023Publication date: March 7, 2024Inventors: Yongwang Xiao, Linfang Jin, Hualin Li, Naixiang Xu, Guoping Wang
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Publication number: 20220217866Abstract: A wireless charging base is provided, and is mainly applied to electronic devices such as a mobile phone and a tablet computer. The wireless charging base includes a charging panel, configured to charge the electronic device. The charging panel includes a first air vent and a second air vent. A first base plate is disposed on an upper surface of the charging panel, is located at an end of the charging panel, and is configured to support the electronic device when the electronic device is being charged. The first base plate includes a third air vent. A second base plate is disposed on the lower surface of the charging panel, is located at the same end as the first base plate, and is configured to support the charging panel. The second base plate includes a fourth air vent.Type: ApplicationFiled: March 25, 2022Publication date: July 7, 2022Inventors: Hao WU, Jun CHEN, Yongwang XIAO, Jun LI
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Publication number: 20210392782Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly. The first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.Type: ApplicationFiled: September 25, 2019Publication date: December 16, 2021Inventors: Yongwang Xiao, Linfang Jin, Hualin Li, Naixiang Xu, Guoping Wang
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Patent number: 10756000Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: GrantFiled: November 14, 2019Date of Patent: August 25, 2020Assignee: Huawei Device Co., Ltd.Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
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Publication number: 20200083144Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: ApplicationFiled: November 14, 2019Publication date: March 12, 2020Inventors: Linfang JIN, Yongwang XIAO, Guoping WANG, Jie Zou, Hualin LI
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Patent number: 10497641Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: GrantFiled: September 24, 2018Date of Patent: December 3, 2019Assignee: HUAWEI DEVICE CO., LTD.Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
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Publication number: 20190027423Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: ApplicationFiled: September 24, 2018Publication date: January 24, 2019Inventors: Linfang JIN, Yongwang XIAO, Guopin WANG, Jie ZOU, Hualin LI
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Patent number: 10156512Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.Type: GrantFiled: February 28, 2014Date of Patent: December 18, 2018Assignee: FUTUREWEI TECHNOLOGIES, INC.Inventors: Qian Han, Junsheng Guo, Yongwang Xiao
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Patent number: 10103087Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: GrantFiled: March 18, 2014Date of Patent: October 16, 2018Assignee: HUAWEI DEVICE (DONGGUAN) CO., LTD.Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
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Publication number: 20170098592Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: ApplicationFiled: March 18, 2014Publication date: April 6, 2017Applicant: HUAWEI DEVICE CO., LTD.Inventors: Linfang JIN, Yongwang XIAO, Guoping WANG, Jie ZOU, Hualin LI
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Publication number: 20140247857Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.Type: ApplicationFiled: February 28, 2014Publication date: September 4, 2014Applicant: FUTUREWEI TECHNOLOGIES, INC.Inventors: Qian Han, Junsheng Guo, Yongwang Xiao