Patents by Inventor Yongwei DONG
Yongwei DONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11388526Abstract: An MEMS microphone is provided, comprising: a first substrate; a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate; and a floating gate field effect transistor outputting a varying electrical signal, the floating gate field effect transistor including a source electrode and a drain electrode both provided on the first substrate and a floating gate provided on the vibration diaphragm.Type: GrantFiled: September 6, 2018Date of Patent: July 12, 2022Assignee: Weifang Goertek Microelectronics Co., Ltd.Inventors: Quanbo Zou, Yongwei Dong
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Patent number: 11297414Abstract: An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electret layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrateType: GrantFiled: September 6, 2018Date of Patent: April 5, 2022Assignee: Goertek, Inc.Inventors: Quanbo Zou, Yongwei Dong
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Patent number: 11202156Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/?m.Type: GrantFiled: September 6, 2018Date of Patent: December 14, 2021Assignee: Goertek, Inc.Inventors: Quanbo Zou, Yongwei Dong
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Publication number: 20210227335Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/?m.Type: ApplicationFiled: September 6, 2018Publication date: July 22, 2021Applicant: Goertek, Inc.Inventors: QUANBO ZOU, Yongwei Dong
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Publication number: 20200359127Abstract: An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electret layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrateType: ApplicationFiled: September 6, 2018Publication date: November 12, 2020Applicant: Goertek, Inc.Inventors: QUANBO ZOU, YONGWEI DONG
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Publication number: 20200260192Abstract: An MEMS microphone is provided, comprising: a first substrate; a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate; and a floating gate field effect transistor outputting a varying electrical signal, the floating gate field effect transistor including a source electrode and a drain electrode both provided on the first substrate and a floating gate provided on the vibration diaphragm.Type: ApplicationFiled: September 6, 2018Publication date: August 13, 2020Applicant: GOERTEK, INC.Inventors: Quanbo Zou, Yongwei Dong
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Publication number: 20200204925Abstract: A MEMS microphone, which comprises a substrate, a first vibrating diaphragm and a second vibrating diaphragm is provided. A sealed cavity is formed between the first vibrating diaphragm and the second vibrating diaphragm. A back electrode unit is located in the sealed cavity, forms a capacitor structure with the first vibrating diaphragm and with the second vibrating diaphragm respectively, and is provided with a plurality of through holes that penetrate through two sides thereof. The sealed cavity is filled with a gas whose viscosity coefficient is smaller than that of air. According to the MEMS microphone disclosed by the present invention, by filling the sealed cavity with a gas whose viscosity coefficient is smaller than that of air, the acoustic resistance when the two vibrating diaphragms move relative to the back electrode can be reduced greatly, thereby reducing the noise of the microphone.Type: ApplicationFiled: November 30, 2017Publication date: June 25, 2020Applicant: Goertek Inc.Inventors: Quanbo ZOU, Zhe WANG, Yongwei DONG