Patents by Inventor Yongwon CHO
Yongwon CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250149293Abstract: A plasma generation circuit includes a high frequency power source configured to generate a first high frequency current; a current divider comprising a first capacitor and a variable capacitor and configured to divide the first high frequency current into a second high frequency current and a third high frequency current; an antenna assembly comprising a center antenna connected to the current divider and through which the second high frequency current is configured to flow, and an edge antenna connected in to the current divider and through which the third high frequency current is configured to flow, the antenna assembly being configured to induce generation of an inductively coupled plasma; a first coil coupled inductor configured to allow the second high frequency current to flow therethrough; and a second coil coupled inductor configured to allow the third high frequency current to flow therethrough and adjacent to the first coil coupled inductor.Type: ApplicationFiled: June 19, 2024Publication date: May 8, 2025Inventors: Jaewon Jeong, Dongchan Jeon, Kyungsun Kim, Sungyeol Kim, Yongwon Cho
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Patent number: 12272863Abstract: An electronic device includes a housing, an antenna structure disposed in an inner space of the housing, a wireless communication circuit disposed in the inner space, and a first bracket. The antenna structure includes a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction. Each of the plurality of chip antennas includes an antenna element and is separated in the third direction from remaining chip antennas by separation spaces. The first bracket includes first and second protrusions that protrude in the second direction to correspond to the first substrate surface of the substrate. The protrusions are aligned, in the third direction, with the separation spaces.Type: GrantFiled: February 13, 2023Date of Patent: April 8, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yonghee An, Pilwon Seo, Bitna Kim, Haewon Sung, Yongwon Cho, Junhee Han, Jeongseob Kim, Hyunsuk Choi
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Patent number: 12160983Abstract: An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.Type: GrantFiled: June 8, 2022Date of Patent: December 3, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Hyunjoong Yoon, Yongwon Cho
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Publication number: 20240290129Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.Type: ApplicationFiled: May 6, 2024Publication date: August 29, 2024Inventors: Junhee HAN, Hanul MOON, Soohwan KIM, Seungjae BAE, Inho SHIN, Jiyoung LIM, Yongwon CHO, Jiwoo LEE
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Patent number: 11978276Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.Type: GrantFiled: November 11, 2022Date of Patent: May 7, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Junhee Han, Hanul Moon, Soohwan Kim, Seungjae Bae, Inho Shin, Jiyoung Lim, Yongwon Cho, Jiwoo Lee
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Patent number: 11955691Abstract: An electronic device according to an embodiment of the disclosure may be configured to include a housing including a conductive plate and a non-conductive plate, a reinforcing member disposed at a first part inside the housing and including a groove of a predetermined length, a printed circuit board disposed at a second part different from the first part inside the housing, an antenna module disposed at one surface of the reinforcing member and including a ground layer at the rear surface thereof, and a signal connection member configured to electrically connect the printed circuit board and the antenna module, wherein a part of the signal connection member extends through the groove and is electrically connected to a first area of the ground layer in the groove by using a solder. Other various embodiments are possible.Type: GrantFiled: March 24, 2022Date of Patent: April 9, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Taekwan Cha, Yongwon Cho
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Patent number: 11800688Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.Type: GrantFiled: November 1, 2019Date of Patent: October 24, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Haein Chung, Kyungha Koo, Seungjae Bae, Hyunjoong Yoon, Jaeho Chung, Yongwon Cho
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Publication number: 20230253698Abstract: An electronic device includes a housing, an antenna structure disposed in an inner space of the housing, a wireless communication circuit disposed in the inner space, and a first bracket. The antenna structure includes a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction. Each of the plurality of chip antennas includes an antenna element and is separated in the third direction from remaining chip antennas by separation spaces. The first bracket includes first and second protrusions that protrude in the second direction to correspond to the first substrate surface of the substrate. The protrusions are aligned, in the third direction, with the separation spaces.Type: ApplicationFiled: February 13, 2023Publication date: August 10, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yonghee AN, Pilwon SEO, Bitna KIM, Haewon SUNG, Yongwon CHO, Junhee HAN, Jeongseob KIM, Hyunsuk CHOI
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Publication number: 20230126247Abstract: An electronic device includes a first housing, a second housing, a hinge device that foldably couples the first housing and the second housing to each other, and at least one electrical connection member that connects a component included in the first housing and a component included in the second housing, to each other. The hinge device may include at least one hinge, at least one first hinge bracket that connects the hinge and the first housing to each other, at least one second hinge bracket that connects the hinge and the second housing to each other, and a support that supports the at least one electrical connection member, where the support may be fixed via the same fastening structure as the first hinge bracket.Type: ApplicationFiled: October 26, 2022Publication date: April 27, 2023Inventors: Hyunjoong YOON, Gyunghoon LEE, Yongwon CHO
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Publication number: 20230118000Abstract: A radio frequency (RF) generating device for generating RF output signals is provided.Type: ApplicationFiled: October 20, 2022Publication date: April 20, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sungyong Lim, Sungyeol Kim, Yongwon Cho, Younghwan Choi, Chunyoon Park, Seungbo Shim, Hyungjung Yong, Jaejoong Lee
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Publication number: 20230082434Abstract: An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.Type: ApplicationFiled: June 8, 2022Publication date: March 16, 2023Inventors: Hyunjoong YOON, Yongwon CHO
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Publication number: 20230063624Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.Type: ApplicationFiled: November 11, 2022Publication date: March 2, 2023Inventors: Junhee HAN, Hanul MOON, Soohwan KIM, Seungjae BAE, Inho SHIN, Jiyoung LIM, Yongwon CHO, Jiwoo LEE
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Patent number: 11527814Abstract: An electronic device including antennas is provided.Type: GrantFiled: May 28, 2021Date of Patent: December 13, 2022Inventors: Junhee Han, Heedong Kim, Inho Shin, Jiyoung Lim, Yongwon Cho, Jiwoo Lee
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Publication number: 20220344795Abstract: An electronic device according to an embodiment of the disclosure may be configured to include a housing including a conductive plate and a non-conductive plate, a reinforcing member disposed at a first part inside the housing and including a groove of a predetermined length, a printed circuit board disposed at a second part different from the first part inside the housing, an antenna module disposed at one surface of the reinforcing member and including a ground layer at the rear surface thereof, and a signal connection member configured to electrically connect the printed circuit board and the antenna module, wherein a part of the signal connection member extends through the groove and is electrically connected to a first area of the ground layer in the groove by using a solder. Other various embodiments are possible.Type: ApplicationFiled: March 24, 2022Publication date: October 27, 2022Inventors: Taekwan CHA, Yongwon CHO
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Patent number: 11456557Abstract: According to an embodiment, disclosed is an electronic device that includes an external interface module including a printed circuit board and at least one part disposed on the printed circuit board, a protective structure including at least one hole area that isolates at least a portion of the at least one part, and a housing that provides at least a bottom portion on which the protective structure is seated. Besides, it may be permissible to prepare various other embodiments speculated through the specification.Type: GrantFiled: October 8, 2019Date of Patent: September 27, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Yongwon Cho, Gyunghoon Lee, Minyong Kim, Samyeol Kang
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Publication number: 20210392787Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.Type: ApplicationFiled: November 1, 2019Publication date: December 16, 2021Inventors: Haein CHUNG, Kyungha KOO, Seungjae BAE, Hyunjoong YOON, Jaeho CHUNG, Yongwon CHO
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Publication number: 20210376453Abstract: An electronic device including antennas is provided.Type: ApplicationFiled: May 28, 2021Publication date: December 2, 2021Inventors: Junhee HAN, Heedong Kim, Inho Shin, Jiyoung Lim, Yongwon Cho, Jiwoo Lee
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Publication number: 20210351542Abstract: According to an embodiment, disclosed is an electronic device that includes an external interface module including a printed circuit board and at least one part disposed on the printed circuit board, a protective structure including at least one hole area that isolates at least a portion of the at least one part, and a housing that provides at least a bottom portion on which the protective structure is seated. Besides, it may be permissible to prepare various other embodiments speculated through the specification.Type: ApplicationFiled: October 8, 2019Publication date: November 11, 2021Inventors: Yongwon CHO, Gyunghoon LEE, Minyong KIM, Samyeol KANG
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Patent number: 11016904Abstract: A storage device includes a controller and a memory. In response to a request of a host, the controller generates: (A) a first list as a result of counting: (1) the number of first page numbers included in a first range among page numbers included in a logical address received from the host and (2) the number of second page numbers included in a second range not overlapping the first range, (B) generates a second list as a result of respectively grouping the first page numbers and the second page numbers based on the first list, and (C) translates the logical address to a physical address based on the second list and the first map data. The memory stores the first map data to be provided to the controller. The first map data matches the first page numbers and the second page numbers with respective physical addresses.Type: GrantFiled: August 17, 2019Date of Patent: May 25, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Yongwon Cho, Hyeonwu Kim, Seok-Won Ahn
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Publication number: 20200151109Abstract: A storage device includes a controller and a memory. In response to a request of a host, the controller generates: (A) a first list as a result of counting: (1) the number of first page numbers included in a first range among page numbers included in a logical address received from the host and (2) the number of second page numbers included in a second range not overlapping the first range, (B) generates a second list as a result of respectively grouping the first page numbers and the second page numbers based on the first list, and (C) translates the logical address to a physical address based on the second list and the first map data. The memory stores the first map data to be provided to the controller. The first map data matches the first page numbers and the second page numbers with respective physical addresses.Type: ApplicationFiled: August 17, 2019Publication date: May 14, 2020Inventors: YONGWON CHO, HYEONWU KIM, SEOK-WON AHN