Abstract: A portable blowing alcohol concentration measuring device is provided, including: a housing, a valve body, a first one-way valve, a second one-way valve and a container. The first one-way valve can be opened and closed between the air inlet of the housing and the valve body; a container is provided at the other end of the housing, and the housing and the container are spaced by a PTFE membrane; the second one-way valve has a suction port connected to a drainage port on the container. The opening and closing of the second one-way valve can make the passage between the suction port and the inside of the valve body to achieve a pass-through. By optimizing the structure and testing method, the alcohol in the exhaled gas is fully dissolved in the solution in the container, and the blood alcohol concentration can be obtained by direct measurement using the fitted function.

Abstract: The invention provides a MEMS micropump testing method and system. The method includes building a control model based on a least-square support vector; determining the magnitude of the pressure in a reservoir component relative to a preset first and second threshold in combination with a pressure value index to obtain a determination result; reading the determination result and controlling accordingly the reservoir component to be in or out of communication with the replenish component and the meter; and obtaining testing data for the under-test micropump based on variation in the liquid in the meter. The replenish component and the reservoir component assist in MEMS micropump testing so that a small volume and flow rate of the output liquid can be tested. The volumes and flow rates of the output liquid from the MEMS micropump at different pressures can be tested by controlling the pressure in the reservoir component.

Abstract: A mixture and method comprising same is described for chemical vibrational mechanical polishing (CVMP) of excess material from the underlying substrate surface. In one embodiment of the present invention, the method comprises: providing the substrate comprising the copper layer and the excess copper-containing material disposed thereupon; introducing the substrate into a vessel containing a chemical mechanical polishing mixture comprising a solution and a plurality of particles wherein the solution comprises an etchant, a modifier, and a surfactant and wherein an average particle diameter of the particles ranges from 100 to 3000 &mgr;m; and agitating the vessel with the substrate contained therein to remove the excess copper-containing material from the substrate.