Patents by Inventor Yongzhen Gao

Yongzhen Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11716812
    Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 1, 2023
    Inventors: Yongzhen Gao, Shangkun Wu, Zhimei Zhang, Xia Gao, Weidong Zhong
  • Publication number: 20220256702
    Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.
    Type: Application
    Filed: December 11, 2019
    Publication date: August 11, 2022
    Applicant: Comba Network Systems Company Limited
    Inventors: Yongzhen Gao, Shangkun Wu, Zhimei Zhang, Xia Gao, Weidong Zhong