Patents by Inventor Yongzhen YU

Yongzhen YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171751
    Abstract: An intelligent encoding method, an intelligent encoding system, and an electronic device are provided. The intelligent encoding method comprises obtaining intelligent encoding information, wherein the intelligent encoding information comprises a maximum target bit rate, a minimum target bit rate, a motion complexity, a texture complexity, and a region of interest; and encoding an input source of an encoder based on the intelligent encoding information. The above intelligent encoding method has strong flexibility.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 23, 2024
    Applicant: Rockchip Electronics Co., Ltd.
    Inventors: Delong HE, Zhichao YU, Yongzhen YU, Zhihua WANG
  • Publication number: 20240129513
    Abstract: An apparatus and a method for outputting image data, and an electronic device are provided. The apparatus includes a first parameter setter, an image signal processor, and an encoder, wherein the first parameter setter sets a first configuration parameter for the image signal processor based on a complexity associated with an input image frame, wherein the image signal processor performs an image signal processing on at least one image frame to generate processed image data based on the first configuration parameter, wherein the encoder performs encoding processing on the processed image data to generate encoded image data. The apparatus and the method for outputting image data, and the electronic device of the present disclosure adjust parameters of the image signal processor and the encoder according to the complexity associated with an input image frame, thereby effectively improving the overall performance of image processing, encoding and compression.
    Type: Application
    Filed: September 1, 2023
    Publication date: April 18, 2024
    Applicant: Rockchip Electronics Co., Ltd.
    Inventors: Zhichao YU, Delong HE, Zhihua WANG, Yongzhen YU