Patents by Inventor Yonksuk Kwon

Yonksuk Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
    Publication number: 20120146204
    Abstract: The device of this invention includes a semiconductor die attached to a bare copper lead frame and electrically coupled to a lead by a metal wire coated with a metallic material. The device would function similarly to devices where the lead frames were coated with other metallic materials, but at lower costs because instead of plating the lead frame the wire is plated. The wire can be either gold or aluminum. When the wire is gold, the coating may be silver or other suitable metallic materials. When the wire is aluminum, the coating may be nickel, palladium, or other suitable metals.
    Type: Application
    Filed: November 14, 2011
    Publication date: June 14, 2012
    Applicant: Fairchild Semiconductor Corporation
    Inventors: Sangdo Lee, Yonksuk Kwon, Bin Cai
  • Semiconductor devices and electrical parts manufacturing using metal coated wires
    Patent number: 8084870
    Abstract: The device of this invention includes a semiconductor die attached to a bare copper lead frame and electrically coupled to a lead by a metal wire coated with a metallic material. The device would function similarly to devices where the lead frames were coated with other metallic materials, but at lower costs because instead of plating the lead frame the wire is plated. The wire can be either gold or aluminum. When the wire is gold, the coating may be silver or other suitable metallic materials. When the wire is aluminum, the coating may be nickel, palladium, or other suitable metals.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: December 27, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Sangdo Lee, Yonksuk Kwon, Bin Cai
  • SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
    Publication number: 20070222042
    Abstract: The device of this invention includes a semiconductor die attached to a bare copper lead frame and electrically coupled to a lead by a metal wire coated with a metallic material. The device would function similarly to devices where the lead frames were coated with other metallic materials, but at lower costs because instead of plating the lead frame the wire is plated. The wire can be either gold or aluminum. When the wire is gold, the coating may be silver or other suitable metallic materials. When the wire is aluminum, the coating may be nickel, palladium, or other suitable metals.
    Type: Application
    Filed: March 26, 2007
    Publication date: September 27, 2007
    Inventors: Sangdo Lee, Yonksuk Kwon, Bin Cai