Patents by Inventor Yonqi Hu

Yonqi Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive polishing article for electrochemical mechanical polishing
    Patent number: 7422516
    Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: September 9, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
  • CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
    Publication number: 20080026681
    Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
    Type: Application
    Filed: October 8, 2007
    Publication date: January 31, 2008
    Inventors: PAUL BUTTERFIELD, Liang-Yuh Chen, Yonqi Hu, Antoine Manens, Rashid Mavliev, Stan Tsai, Feng Liu, Ralph Wadensweiler, Lizhong Sun, Siew Neo, Alain Duboust
  • Conductive polishing article for electrochemical mechanical polishing
    Patent number: 7278911
    Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: October 9, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
  • Conductive polishing article for electrochemical mechanical polishing
    Publication number: 20050284770
    Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
    Type: Application
    Filed: August 30, 2005
    Publication date: December 29, 2005
    Inventors: Paul Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine Manens, Rashid Mavliev, Stan Tsai, Feng Liu, Ralph Wadensweiler, Lizhong Sun, Siew Neo, Alain Duboust
  • Conductive polishing article for electrochemical mechanical polishing
    Patent number: 6962524
    Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: November 8, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust