Patents by Inventor Yoo Jin Jeoung

Yoo Jin Jeoung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the same
    Patent number: 10269111
    Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: April 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonseo Song, Sung Yoon Ryu, Wahseng Yap, Yunjung Jee, Yusin Yang, Chungsam Jun, Yoo Jin Jeoung, Jaehyung Ahn, Janghee Lee
  • METHOD OF INSPECTING SEMICONDUCTOR WAFER, AN INSPECTION SYSTEM FOR PERFORMING THE SAME, AND A METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20180053292
    Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.
    Type: Application
    Filed: May 17, 2017
    Publication date: February 22, 2018
    Inventors: Joonseo Song, Sung Yoon Ryu, Wahseng Yap, Yunjung Jee, Yusin Yang, Chungsam Jun, Yoo Jin Jeoung, Jaehyung Ahn, Janghee Lee