Patents by Inventor Yoo-Keum Wee

Yoo-Keum Wee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package board, semiconductor package, and fabricating method thereof
    Patent number: 7592708
    Abstract: With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board and having at least one bump attached to at least a portion of the circuit lines, where the solder resist comprises a perimeter groove, which exposes at least a portion of the circuit lines, and an extension groove, which is connected to the perimeter groove, and where encapsulant is filled in the perimeter groove and the extension groove, the filling characteristics of the encapsulant is improved for greater reliability in the electrical connections between the chip and the board.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: September 22, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung-Gu Kim, Je-Gwang Yoo, Yong-Bin Lee, Yoo-Keum Wee, Seok-Hwan Huh, Chang-Sup Ryu
  • Package board, semiconductor package, and fabricating method thereof
    Publication number: 20070080469
    Abstract: With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board and having at least one bump attached to at least a portion of the circuit lines, where the solder resist comprises a perimeter groove, which exposes at least a portion of the circuit lines, and an extension groove, which is connected to the perimeter groove, and where encapsulant is filled in the perimeter groove and the extension groove, the filling characteristics of the encapsulant is improved for greater reliability in the electrical connections between the chip and the board.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 12, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung-Gu Kim, Je-Gwang Yoo, Yong-Bin Lee, Yoo-Keum Wee, Seok-Hwan Huh, Chang-Sup Ryu