Patents by Inventor Yoo S. Hong

Yoo S. Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5510300
    Abstract: The present invention relates to low temperature sealing glass compositions using ceramic composite filler useful for sealing alumina ceramic package, in particular, to compositions for hermetic-sealing cap and base of alumina package which consists of a solid PbO-B.sub.2 O.sub.3 glass powder and a filler selected from zinc zirconium silicate composite or magnesium aluminum zirconium silicate composite as a low thermal expansion ceramic composite. The used composite filler composes of zircon and willemite crystal phase or zircon and cordierite crystal phase uniformly mixed on the filler and has the low thermal expansion coefficient of 20.degree..about.40.degree..times.10.sup.-7 /.degree.C.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: April 23, 1996
    Assignee: Samsung Corning Co., Ltd.
    Inventors: Byung C. Lim, Yoo S. Hong, Ki Y. Lee, Tae H. Park