Abstract: A fabricating method of a capacitor is disclosed. Particularly, a fabricating method of a capacitor which forms a capacitor in the place where the insulation layer of an STI region is removed, preventing interlayer dielectric layers from becoming thick. A disclosed method comprises: defining an STI region in the predetermined region of a substrate; removing the insulation layer of the STI region where a capacitor will be formed; forming a gate insulation layer and a first polysilicon layer on the substrate, and patterning the first polysilicon layer; and forming a first insulation layer and a second polysilicon layer on the substrate, and patterning the first insulation layer and the second polysilicon layer.

Abstract: A bipolar transistor and method of fabricating the same is disclosed. Particularly, a bipolar transistor may have an emitter and a collector diffusion layer in the sidewalls and the bottom of a device isolation trench. A method includes the steps of: forming a device isolation trench in a substrate; forming a photoresist pattern and implanting ions into the sidewalls and the bottom of the trench to form an emitter and a collector; removing the photoresist pattern; and filling the trench with an insulation layer to form the device isolation structure. Accordingly, the transistor and method can minimize device area by forming the diffusion layer of an emitter and a collector in the sidewalls and the bottom of the trench, and can provide a deep impurity diffusion layer without a high temperature diffusion process. In addition, the transistor and method can provide both a high amplification factor and a high current driving force.