Patents by Inventor Yoo Seong Yang

Yoo Seong Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10712299
    Abstract: A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (?h) of the specimen.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ga Hee Kim, Young Suk Jung, Yoo Seong Yang, Young Hoon Lee, Hyun Mi Lee
  • Publication number: 20180128758
    Abstract: A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (?h) of the specimen.
    Type: Application
    Filed: April 10, 2017
    Publication date: May 10, 2018
    Inventors: Ga Hee KIM, Young Suk JUNG, Yoo Seong YANG, Young Hoon LEE, Hyun Mi LEE
  • Patent number: 9758391
    Abstract: A capacitive deionization electrode may include a conductive material and a polymer on a surface of the conductive material. The polymer may have at least one functional group in a single polymer chain.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: September 12, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoo Seong Yang, Jae Eun Kim, Hyun Seok Kim, Seung Jae Lee, Hyo Rang Kang, Joon Seon Jeong
  • Publication number: 20150175449
    Abstract: A capacitive deionization electrode may include a conductive material and a polymer on a surface of the conductive material. The polymer may have at least one functional group in a single polymer chain.
    Type: Application
    Filed: December 17, 2014
    Publication date: June 25, 2015
    Inventors: Yoo Seong YANG, Jae Eun KIM, Hyun Seok KIM, Seung Jae LEE, Hyo Rang KANG, Joon Seon JEONG
  • Patent number: 8936849
    Abstract: Provided are a polyamide combination that includes: a first polyamide including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second polyamide including a repeating unit represented by Chemical Formula 3, and a film prepared using the polyamide combination.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: January 20, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chung Kun Cho, Kalinina Fedosya, Kovalev Mikhail, Tai Gyoo Park, Young Suk Jung, Yoo Seong Yang
  • Patent number: 8623968
    Abstract: A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A2-NCO??Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: January 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun Seog Cho, Byung Hee Sohn, Young Suk Jung, Yoo Seong Yang, Sang Mo Kim
  • Patent number: 8586689
    Abstract: A polymer including a structural unit represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above formula at least one of Ra and Rb is either Chemical Formula 3 or Chemical Formula 4, as shown below. The polymer also includes units selected from polyamic acid, polyimide, polyaramid, polyamide, polyurethane, polycarbonate and polyacetal units and mixtures of such units.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: November 19, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Suk Jung, Yoo Seong Yang, Tai Gyoo Park, Sang Mo Kim, Eun Seog Cho
  • Patent number: 8461662
    Abstract: A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: June 11, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun-Sung Lee, Jin-Young Bae, Yoo-Seong Yang, Sang-Soo Jee
  • Patent number: 8426550
    Abstract: A polyamic acid that is a condensation reaction product of one or more acid anhydrides and one or more carbonate-based diamine compounds, along with a polyimide obtained by imidizing the polyamic acid, a method of manufacturing the same, and a polyimide film made therefrom.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: April 23, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-Hee Sohn, Young-Suk Jung, Yoo-Seong Yang, Sang-Mo Kim, Eun-Seog Cho
  • Patent number: 8399593
    Abstract: A polymer including a structure represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above Chemical Formula 1, each substituent is as defined in the detailed description.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: March 19, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Suk Jung, Yoo-Seong Yang, Byung-Hee Sohn, Sang-Mo Kim, Eun-Seog Cho
  • Patent number: 8304473
    Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: November 6, 2012
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yoo-Seong Yang, Eun-Sung Lee, Sang-Soo Jee, Soon-Jae Kwon
  • Patent number: 8278378
    Abstract: Disclosed are an organosilicate compound represented by the following Chemical Formula 1, and a composition and a film including the same. In the above Chemical Formula 1, each substituent is as defined in the detailed description.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: October 2, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Suk Jung, Sang-Mo Kim, Byung-Hee Sohn, Yoo-Seong Yang, Eun-Seog Cho
  • Publication number: 20120238698
    Abstract: Provided are a polyamide combination that includes: a first polyamide including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second polyamide including a repeating unit represented by Chemical Formula 3, and a film prepared using the polyamide combination.
    Type: Application
    Filed: September 24, 2011
    Publication date: September 20, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chung Kun CHO, Kalinina FEDOSYA, Kovalev MIKHAIL, Tai Gyoo PARK, Young Suk JUNG, Yoo Seong YANG
  • Publication number: 20120184688
    Abstract: A polymer including a structural unit represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above Chemical Formula 1, each substituent is defined as described in the specification.
    Type: Application
    Filed: August 4, 2011
    Publication date: July 19, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Suk JUNG, Yoo Seong YANG, Tai Gyoo PARK, Sang Mo KIM, Eun Seog CHO
  • Publication number: 20120157652
    Abstract: A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A2-NCO??Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.
    Type: Application
    Filed: September 7, 2011
    Publication date: June 21, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Seog CHO,, Byung Hee SOHN, Young Suk JUNG, Yoo Seong YANG, Sang Mo KIM
  • Publication number: 20120008252
    Abstract: A dielectric paste having low dielectric loss is disclosed. The dielectric paste includes (A) a thermosetting resin; (B) an acid anhydride-based curing agent; (C) high dielectric constant particles; (D) an amine-based catalyst; and (E) a material for forming a salt with the amine-based catalyst (D). In the dielectric paste, the material (E) for forming a salt with the amine-based catalyst (D) is used so that the catalyst may be introduced in the form of a salt thus preventing the catalyst from binding with the high dielectric constant particles, thereby prohibiting the poisoning of the catalyst.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 12, 2012
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoo Seong YANG, Eun Sung LEE
  • Publication number: 20110137009
    Abstract: A polyamic acid that is a condensation reaction product of one or more acid anhydrides and one or more carbonate-based diamine compounds, along with a polyimide obtained by imidizing the polyamic acid, a method of manufacturing the same, and a polyimide film made therefrom.
    Type: Application
    Filed: July 7, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung-Hee SOHN, Young-Suk JUNG, Yoo-Seong YANG, Sang-Mo KIM, Eun-Seog CHO
  • Patent number: 7943856
    Abstract: A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: May 17, 2011
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Samsung Fine Chemicals Co., Ltd.
    Inventors: Yoo Seong Yang, Myung Sup Jung, Chung Kun Cho, Sang Hyuk Suh, Bon Hyeok Gu
  • Publication number: 20110105663
    Abstract: Disclosed are an organosilicate compound represented by the following Chemical Formula 1, and a composition and a film including the same. In the above Chemical Formula 1, each substituent is as defined in the detailed description.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Suk JUNG, Sang-Mo KIM, Byung-Hee SOHN, Yoo-Seong YANG, Eun-Seog CHO
  • Publication number: 20110105678
    Abstract: A polymer including a structure represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above Chemical Formula 1, each substituent is as defined in the detailed description.
    Type: Application
    Filed: August 2, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Suk JUNG, Yoo-Seong YANG, Byung-Hee SOHN, Sang-Mo KIM, Eun-Seog CHO