Patents by Inventor Yoo-Seung Yang

Yoo-Seung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8798672
    Abstract: A method of controlling a mobile terminal, and which includes controlling, via a Windows processor, a plurality of peripheral devices of the mobile terminal; switching, via the Windows processor, the mobile terminal into a sleep state; granting, via an arbiter control processor, a control authority for controlling predetermined peripheral devices among the plurality of peripheral device to a 3G modem when the mobile terminal is switched into the sleep state; receiving, via a communication unit on the mobile terminal, an incoming call; and managing, via the 3G modem, circuit data and the predetermined peripheral devices for the incoming call.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: August 5, 2014
    Assignee: LG Electronics Inc.
    Inventors: Guk-Chan Lim, Yoo-Seung Yang, Joo-Yong Lee, Dong-Chul Jin, Hung-Chol Chin, Sang-Mo Park, Hyun-Jung Park, Hyun-Jun Kim, Haeng-Chul Kwak, Man-Soo Sin
  • Publication number: 20110171995
    Abstract: A method of controlling a mobile terminal, and which includes controlling, via a Windows processor, a plurality of peripheral devices of the mobile terminal; switching, via the Windows processor, the mobile terminal into a sleep state; granting, via an arbiter control processor, a control authority for controlling predetermined peripheral devices among the plurality of peripheral device to a 3G modem when the mobile terminal is switched into the sleep state; receiving, via a communication unit on the mobile terminal, an incoming call; and managing, via the 3G modem, circuit data and the predetermined peripheral devices for the incoming call.
    Type: Application
    Filed: April 30, 2010
    Publication date: July 14, 2011
    Inventors: Guk-Chan LIM, Yoo-Seung YANG, Joo-Yong LEE, Dong-Chul JIN, Hung-Chol CHIN, Sang-Mo PARK, Hyun-Jung PARK, Hyun-Jun KIM, Haeng-Chul KWAK, Man-Soo SIN
  • Patent number: 7887887
    Abstract: Disclosed herein is a liquid crystal polyester resin composition and a printed circuit board using the composition. The composition comprises a liquid crystal polyester, a polybenzimidazole and an aprotic solvent. The composition exhibits good thermal stability and has a low dielectric constant. The composition can be advantageously used as a material for printed circuit boards (PCBS) used in semiconductor packages, mobile devices and LCD devices.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: February 15, 2011
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Samsung Fine Chemicals Co., Ltd.
    Inventors: Chung-Kun Cho, Myung-Sup Jung, Yoo-Seung Yang, Mahn-Jong Kim, Tae-Jun Ok
  • Publication number: 20090111949
    Abstract: Disclosed herein is a liquid crystal polyester resin composition and a printed circuit board using the composition. The composition comprises a liquid crystal polyester, a polybenzimidazole and an aprotic solvent. The composition exhibits good thermal stability and has a low dielectric constant. The composition can be advantageously used as a material for printed circuit boards (PCBS) used in semiconductor packages, mobile devices and LCD devices.
    Type: Application
    Filed: May 20, 2008
    Publication date: April 30, 2009
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD., SAMSUNG FINE CHEMICALS CO., LTD.
    Inventors: Chung Kun CHO, Myung Sup JUNG, Yoo Seung YANG, Mahn Jong KIM, Tae Jun OK
  • Publication number: 20090092800
    Abstract: Example embodiments provide a composition for preparing modified polyimide/clay nanocomposites. The composition comprises a modified polyamic acid terminated with groups at both ends of the backbone and a layered clay compound. Example embodiments provide a method for preparing modified polyimide/clay nanocomposites using the composition. Polyimide/clay nanocomposites prepared by the method exhibit excellent thermal properties. Therefore, the polyimide/clay nanocomposites can find many useful applications as materials for next-generation substrates that are small in size and thickness and light in weight.
    Type: Application
    Filed: April 7, 2008
    Publication date: April 9, 2009
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD., SAMSUNG FINE CHEMICALS CO., LTD
    Inventors: Yoo Seung YANG, Myung Sup JUNG, Chung Kun CHO