Patents by Inventor Yoo Sun Kim

Yoo Sun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL BENZOTRIAZOLE DERIVATIVE HAVING INHIBITORY ACTIVITY AGAINST ECTONUCLEOTIDE PYROPHOSPHATASE-PHOSPHODIESTERASE, AND USE THEREOF
    Publication number: 20240116882
    Abstract: The present invention relates to a novel benzotriazole derivative compound, a tautomer thereof, a pharmaceutically acceptable salt thereof, a hydrate thereof, or a stereoisomer thereof, which are related to a compound for inhibiting ENPP1, a composition for inhibiting ENPP1, and a method for inhibiting ENPP1.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: TXINNO BIOSCIENCE INC.
    Inventors: Chan Sun Park, Sung Joon Kim, Ali Imran, Yoo Jin Na, So Ra Paik, Jung Hwan Choi, Sun Woo Lee, Yong Yea Park, Ah Ran Yu, Sun Young Park
  • Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
    Patent number: 10172241
    Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: January 1, 2019
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim, Yoo Sun Kim
  • Device for bonding flexible PCB to camera module
    Patent number: 9113586
    Abstract: Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 18, 2015
    Assignees: LG INNOTEK CO., LTD., KAIST (KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Jae Chun Lee, Kyuong-wook Paik, Yoo Sun Kim, Kiwon Lee
  • METHOD FOR PACKAGING FLEXIBLE DEVICE USING HOLDING WAFER, AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME
    Publication number: 20150077949
    Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 19, 2015
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim, Yoo Sun Kim