Abstract: Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad.