Abstract: An alkali-soluble resin is provided. The alkali-soluble resin is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin has a lower viscosity than a resin having the same molecular weight. Further provided is a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin. The use of the alkali-soluble resin lowers the overall viscosity of the photosensitive resin composition to effectively reduce the height of a stepped portion of a photoresist pattern using a small amount of the photosensitive resin composition.

Abstract: The present invention relates to a photoactive compound having a novel structure and a photosensitive resin composition including the same, and the photoactive compound according to the present invention has excellent sensitivity due to efficient absorption to a UV light source by including a nitro group and a phosphonate structure, and has excellent retention rate, mechanical strength, heat resistance, chemical resistance and developing resistance by improving solubility of the photosensitive resin composition by excellent compatibility of the phosphonate structure and a binder resin. Therefore, the photosensitive resin composition according to the present invention is useful to cure a column spacer, an overcoat, a passivation material and the like of a liquid crystal display device, and is useful in view of a high temperature process property.

Abstract: The present invention relates to a polymer having a novel structure and a photosensitive resin composition comprising the same. A photosensitive resin composition comprising a polymer according to the present invention has a high taper angle and excellent adhesion strength. Accordingly, the photosensitive resin composition comprising the polymer according to the present invention may be applied to various photosensitive materials, and particularly, may be preferably applied when a color filter pattern for LCD is manufactured.

Abstract: A colored dispersion according to the present invention comprises a resin including monomers of Formulas 1 to 4, as a binder resin. Accordingly, a photoresist composition for a black matrix of a high light shielding property, which has the dispersion stability of the colored dispersion according to the present invention, could be provided, and a black matrix of high sensibility having an uniform process characteristic while maintaining a high light-shielding property could be produced.

Abstract: The present invention relates to a photoactive compound having a novel structure and a photosensitive resin composition including the same, and the photoactive compound according to the present invention has excellent sensitivity due to efficient absorption to a UV light source by including a nitro group and a phosphonate structure, and has excellent retention rate, mechanical strength, heat resistance, chemical resistance and developing resistance by improving solubility of the photosensitive resin composition by excellent compatibility of the phosphonate structure and a binder resin. Therefore, the photosensitive resin composition according to the present invention is useful to cure a column spacer, an overcoat, a passivation material and the like of a liquid crystal display device, and is useful in view of a high temperature process property.

Abstract: The present invention relates to a fluorene-based resin polymer, and a photosensitive resin composition including the same, and the fluorene-based resin polymer according to the exemplary embodiment of the present invention has a high molecular weight, a low acid value, and excellent developing property, adhesive property and stability.

Abstract: The present application relates to a new silane-based compound, a photosensitive resin composition including the same, and a photosensitive material including the same. The photosensitive resin composition including the silane-based compound according to the exemplary embodiment of the present application increases adhesion strength to a substrate, such that a developing property is excellent and there are no surface stains or defects during a subsequent process. Accordingly, a photosensitive material, a color filter and the like having excellent quality may be manufactured by using the photosensitive resin composition according to the exemplary embodiment of the present application.

Abstract: Provided is a novel fluorene-based polymer having urethane bonds and a method for preparing the fluorene-based polymer. According to the method, a diol compound is condensed with a diisocyanate instead of an acid dianhydride, and then an acid anhydride is reacted with the reaction mixture to introduce desired acid groups into the final polymer. Further provided is a negative-type photosensitive resin composition comprising of the fluorene-based polymer as a binder resin. The composition exhibits improved chemical resistance, good development margin and high sensitivity due to presence of the acid groups despite the low molecular weight of the fluorene-based polymer.

Abstract: The present application relates to a new silane-based compound, a photosensitive resin composition including the same, and a photosensitive material including the same. The photosensitive resin composition including the silane-based compound according to the exemplary embodiment of the present application increases adhesion strength to a substrate, such that a developing property is excellent and there are no surface stains or defects during a subsequent process. Accordingly, a photosensitive material, a color filter and the like having excellent quality may be manufactured by using the photosensitive resin composition according to the exemplary embodiment of the present application.

Abstract: The present invention relates to a polymer having a novel structure and a photosensitive resin composition comprising the same. A photosensitive resin composition comprising a polymer according to the present invention has a high taper angle and excellent adhesion strength. Accordingly, the photosensitive resin composition comprising the polymer according to the present invention may be applied to various photosensitive materials, and particularly, may be preferably applied when a color filter pattern for LCD is manufactured.

Abstract: The present invention relates to a photosensitive resin composition that includes a polymer prepared by using a macromonomer as an alkali soluble resin. The photosensitive resin composition is used for various types of purposes such as a photoresist for preparing a color filter, an overcoat photoresist, a column spacer, and an insulating material having a light blocking property, and improves physical properties such as residue or not, chemical resistance, and heat resistance of the photoresist.

Abstract: The present invention relates to a fluorene-based resin polymer having a repeating unit of Formula 1 and a method for preparing the same. The fluorene-based resin polymer has a high molecular weight and low acid value, and has an excellent developing property, adhesive property, and stability.

Abstract: The present invention relates to a composition for preparing a curable resin, comprising a) a compound represented by Formula 1; b) glycidyl (meth)acrylate; c) acid monoanhydride; and d) a solvent, a curable resin manufactured by the composition, and an ink composition comprising the same. The curable resin has a low viscosity and excellent flow properties, and the ink composition is excellent in terms of storage stability, heat resistance and chemical resistance.

Abstract: The present invention relates to a novel alkali-developable resin, a method of producing the alkali-developable resin, a photosensitive resin composition including the alkali-developable resin, and a device that is manufactured by using the photosensitive composition. In the case of when the alkali-developable resin is used as a component of the photosensitive composition, the photosensitivity, the developability and the film remaining rate of the pattern are improved.

Abstract: Provided are a photosensitive resin and a photosensitive resin composition comprising the photosensitive resin. The photosensitive resin has the structure of Formula 1, which is described in the specification. The photosensitive resin and the photosensitive resin composition have good sensitivity, improved resistance to heat and chemicals, and excellent storage stability. Further provided are a method for preparing the photosensitive resin and a cured product of the photosensitive resin composition.

Abstract: The present invention relates to a fluorene-based resin polymer, and a photosensitive resin composition including the same, and the fluorene-based resin polymer according to the exemplary embodiment of the present invention has a high molecular weight, a low acid value, and excellent developing property, adhesive property and stability.

Abstract: Disclosed is a multifunctional urethane monomer prepared by reacting (a) an epoxy compound having two or more epoxy groups, (b) a diol compound having an acidic group and (c) a compound having an ethylenically unsaturated group and an isocyanate group with one another. The photosensitive resin composition comprising the multifunctional urethane monomer has low viscosity, superior sensitivity, excellent chemical resistance and heat-resistance and high development margin.

Abstract: Provided are an alkali soluble binder resin that includes a monomer including an unsaturated double bond, an unsaturated double bond character monomer including a carboxylic acid and an unsaturated double bond character monomer including an allyl group as a repeating unit, in which a molecular weight distribution (Mw/Mn) is in a range of about 2.0 to about 3.5, and a negative-type photosensitive resin composition including the alkali soluble binder resin. Re-solubility, fine-patterned substrate adhesion and dispersion stability may be improved by including the alkali soluble binder resin according to the present invention.

Abstract: Disclosed is a multifunctional urethane monomer prepared by reacting (a) an epoxy compound having two or more epoxy groups, (b) a diol compound having an acidic group and (c) a compound having an ethylenically unsaturated group and an isocyanate group with one another. The photosensitive resin composition comprising the multifunctional urethane monomer has low viscosity, superior sensitivity, excellent chemical resistance and heat-resistance and high development margin.

Abstract: The present invention relates to a novel alkali-developable resin, a method of producing the alkali-developable resin, a photosensitive resin composition including the alkali-developable resin, and a device that is manufactured by using the photosensitive composition. In the case of when the alkali-developable resin is used as a component of the photosensitive composition, the photosensitivity, the developability and the film remaining rate of the pattern are improved.