Patents by Inventor Yoon-hoon Kim

Yoon-hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package on package having improved thermal characteristics
    Patent number: 8796835
    Abstract: Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: August 5, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-Hoon Kim, Joong-Hyun Baek, Eun-Seok Cho
  • Package On Package Having Improved Thermal Characteristics
    Publication number: 20110304035
    Abstract: Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 15, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon-hoon Kim, Joong-hyun Baek, Eun-seok Cho