Patents by Inventor Yoon Hyuck Choi

Yoon Hyuck Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100464
    Abstract: An air filter comprises: a first filter frame in which a plurality of first chambers are formed; a second filter frame in which a plurality of second chambers are formed and which is arranged at the rear of the first filter frame; and a filter material which is accommodated in the plurality of first chambers and the plurality of second chambers to filter air, wherein the first filter frame and the second filter frame are arranged so that, when seen from the front, the center of each of the plurality of second chambers is out of line with the center of each of the plurality of first chambers, in the vertical direction.
    Type: Application
    Filed: January 28, 2022
    Publication date: March 28, 2024
    Applicant: COWAY CO., LTD.
    Inventors: Yoon Hyuck CHOI, Hyun Kyu LEE, Jong Cheol KIM, Seung Ki KIM, Sung Sil KANG, Ju Hyun BAEK, Chan Jung PARK
  • Publication number: 20230266025
    Abstract: A composite filter includes a filter unit including a filter member having filtering parts, at least one filter module arranged in parallel with at least one of the filtering parts, and a bracket supporting the filtering parts disposed adjacent to each other and the filter module so that the filtering parts disposed adjacent to each other are rotatable. The bracket includes a folded portion that is selectively folded according to the relative rotation of the filtering parts, and attachment portions connected to the folded portion with the folded portion interposed therebetween, and attached to the side surfaces of the filtering parts disposed adjacent to each other. The folded portion and the attachment portions are provided integrally and are formed of a flexible material, and the attachment portion extend to the side surface of the filter module adjacent thereto to seal a gap between the filtering part and the filter module.
    Type: Application
    Filed: June 29, 2021
    Publication date: August 24, 2023
    Applicant: COWAY CO., LTD.
    Inventors: Yu Young NAM, Yoon Hyuck CHOI, Ki Soo KIM KIM, Jun Hyoung BAE, Jhe Hong KIM, Ju Hyun BAEK, Chan Jung PARK
  • Publication number: 20230233971
    Abstract: An air purifier has an air filter including: a filter member including a plurality of filtration regions each having a plurality of vertical pleats extending in an up-down direction and side surfaces connected to be rotatable with respect to each other; and a frame having a plurality of supports for supporting the plurality of filtration regions. Each of the plurality of supports includes a groove having a shape corresponding to any one of an upper edge and a lower edge of each of the filtration regions. Each of the filtration regions is supported by the supports by at least a part of the upper edge or the lower edge being inserted into the groove.
    Type: Application
    Filed: June 21, 2021
    Publication date: July 27, 2023
    Applicant: COWAY CO., LTD.
    Inventors: Yoon Hyuck CHOI, Sung Il MOON, Jun Houng BAE, Yu Young NAM, Sun Duck KWON, Ju Hyun BAEK, Chan Jung PARK
  • Publication number: 20230085459
    Abstract: An antimicrobial filter media, which includes a non-woven fabric; and an antimicrobial agent bound to the nonwoven fabric by a binder, the antimicrobial agent including silver sodium zirconium hydrogenphosphate and thiabendazole, and the silver sodium zirconium hydrogenphosphate and the thiabendazole are employed at a weight ratio of 1:1.5 to 1.5:1, to an air cleaner including the same, and to a process for preparing the same. The antimicrobial filter media includes silver sodium zirconium hydrogenphosphate and thiabendazole, as an antimicrobial agent, at a specific weight ratio. As a result, it is possible to effectively filter harmful microorganisms to supply purified air, to have excellent antibacterial, antiviral, and antifungal properties at the same time, and to further enhance the durability and lifespan characteristics by virtue of excellent filter damage prevention effect.
    Type: Application
    Filed: July 29, 2022
    Publication date: March 16, 2023
    Applicant: COWAY Co., Ltd.
    Inventors: Kyung Hwan LEE, Yoon Hyuck CHOI, Jong Cheol KIM
  • Patent number: 9947457
    Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: April 17, 2018
    Assignee: SEMCNS CO., LTD.
    Inventors: Yoon Hyuck Choi, Kwang Jae Oh, Ki Young Kim
  • Publication number: 20170169931
    Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
    Type: Application
    Filed: February 27, 2017
    Publication date: June 15, 2017
    Inventors: Yoon Hyuck CHOI, Kwang Jae OH, Ki Young KIM
  • Patent number: 9607754
    Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: March 28, 2017
    Assignee: SEMCNS CO., LTD
    Inventors: Yoon Hyuck Choi, Kwang Jae Oh, Ki Young Kim
  • Publication number: 20140176181
    Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
    Type: Application
    Filed: September 17, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Hyuck Choi, Kwang Jae Oh, Ki Young Kim
  • Publication number: 20140176171
    Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; and signal electrodes, power electrodes, and ground electrodes disposed on the first surface, wherein the signal electrodes, the power electrodes, and the ground electrodes are repeatedly disposed while configuring a unit pattern.
    Type: Application
    Filed: July 30, 2013
    Publication date: June 26, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yoon Hyuck Choi, Kwang Jae Oh, Kuk Hyun Kim
  • Patent number: 8692136
    Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: April 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Jae Oh, Joo Yong Kim, Yoon Hyuck Choi, Bong Gyun Kim
  • Publication number: 20130299221
    Abstract: There is provided a space transformer for a probe card, including: a substrate having a first surface and a second; a plurality of first pads formed on the first surface to be spaced apart from each other and connected to a printed circuit board of a probe card; a plurality of second pads formed on the second surface in positions corresponding to those of the first pads and receiving external electrical signals applied thereto; a plurality of via electrodes penetrating through the substrate and respectively connected to the plurality of first pads and the plurality of second pads formed in the positions corresponding to each other; a ground layer formed to cover the second surface and provided with a plurality of second pad exposure holes; and an insulating layer formed to cover the ground layer and the plurality of second pads.
    Type: Application
    Filed: October 4, 2012
    Publication date: November 14, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jae OH, Yoon Hyuck CHOI, Bong Gyun KIM, Joo Yong KIM
  • Patent number: 8397379
    Abstract: A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: March 19, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Hong Sung, Yoon Hyuck Choi
  • Patent number: 8330049
    Abstract: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased. Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: December 11, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yoon Hyuck Choi, Dae Hyeong Lee, Jin Waun Kim, Kwang Jae Oh
  • Publication number: 20120047730
    Abstract: A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.
    Type: Application
    Filed: January 31, 2011
    Publication date: March 1, 2012
    Inventors: Je Hong SUNG, Yoon Hyuck Choi
  • Publication number: 20120013360
    Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
    Type: Application
    Filed: December 9, 2010
    Publication date: January 19, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jae Oh, Joo Yong Kim, Yoon Hyuck Choi, Bong Gyun Kim
  • Publication number: 20120007781
    Abstract: There is provided an antenna module. The antenna module according to the present invention may include a patch antenna resonator formed on a surface of a dielectric substrate; and a surface wave-radiation resonator disposed to be separated from the patch antenna resonator, and formed to surround the patch antenna resonator so that signals from the patch antenna resonator are radiated. In this instance, the signals may flow on the surface of the dielectric substrate.
    Type: Application
    Filed: January 4, 2011
    Publication date: January 12, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joo Yong KIM, Dong Young KIM, Kwang Jae OH, Yun Hwi PARK, Bong Gyun KIM, Yoon Hyuck CHOI, Seok Chool YOON
  • Patent number: 8053682
    Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: November 8, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yun Hwi Park, Bong Gyun Kim, Yoon Hyuck Choi
  • Publication number: 20110011636
    Abstract: There are provided a multilayer wiring board and a method of manufacturing the same. The multilayer wiring board according to an aspect of the invention may include: a main body having a plurality of insulting layers stacked upon each other, including a first layer provided as an inner layer and a second layer provided as an outer layer; a first resistor provided on the first layer; and a second resistor provided on the second layer, connected in parallel with the first resistor, and having a smaller area than the first resistor. The multilayer wiring board obtains a target resistance value using the first and second resistors formed on the first and second layers. The second resistor, formed on the outer layer, can have a smaller area than the first resistor. Accordingly, the usable area of the outer layer is increased to thereby reduce the size of the multilayer wiring board.
    Type: Application
    Filed: December 22, 2009
    Publication date: January 20, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jae Oh, Joo Yong Kim, Yoon Hyuck Choi
  • Publication number: 20100252305
    Abstract: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased. Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.
    Type: Application
    Filed: August 31, 2009
    Publication date: October 7, 2010
    Inventors: Yoon Hyuck CHOI, Dae Hyeong Lee, Jin Waun Kim, Kwang Jae Oh
  • Publication number: 20100055393
    Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.
    Type: Application
    Filed: May 18, 2009
    Publication date: March 4, 2010
    Inventors: Yun Hwi PARK, Bong Gyun Kim, Yoon Hyuck Choi