Abstract: A filter holder comprises: a plurality of filter frames disposed such that at least some thereof are adjacent to each other; and a folding member which supports filter frames, from among the plurality of filter frames, adjacent to each other so as to be rotatable with respect to each other. The folding member comprises: a folding part which has a predetermined thickness and is flexible so as to be foldable by means of rotation of the adjacent filter frames adjacent with respect to each other; and a plurality of edge parts which are connected to the respective sides of the folding part with the folding portion therebetween and rotate together with the adjacent filter frames, and wherein when viewed from a cross-section of the folding member, the edge parts may have a greater thickness than the folding part.

Abstract: An air filter comprises: a first filter frame in which a plurality of first chambers are formed; a second filter frame in which a plurality of second chambers are formed and which is arranged at the rear of the first filter frame; and a filter material which is accommodated in the plurality of first chambers and the plurality of second chambers to filter air, wherein the first filter frame and the second filter frame are arranged so that, when seen from the front, the center of each of the plurality of second chambers is out of line with the center of each of the plurality of first chambers, in the vertical direction.

Abstract: A composite filter includes a filter unit including a filter member having filtering parts, at least one filter module arranged in parallel with at least one of the filtering parts, and a bracket supporting the filtering parts disposed adjacent to each other and the filter module so that the filtering parts disposed adjacent to each other are rotatable. The bracket includes a folded portion that is selectively folded according to the relative rotation of the filtering parts, and attachment portions connected to the folded portion with the folded portion interposed therebetween, and attached to the side surfaces of the filtering parts disposed adjacent to each other. The folded portion and the attachment portions are provided integrally and are formed of a flexible material, and the attachment portion extend to the side surface of the filter module adjacent thereto to seal a gap between the filtering part and the filter module.

Abstract: An air purifier has an air filter including: a filter member including a plurality of filtration regions each having a plurality of vertical pleats extending in an up-down direction and side surfaces connected to be rotatable with respect to each other; and a frame having a plurality of supports for supporting the plurality of filtration regions. Each of the plurality of supports includes a groove having a shape corresponding to any one of an upper edge and a lower edge of each of the filtration regions. Each of the filtration regions is supported by the supports by at least a part of the upper edge or the lower edge being inserted into the groove.

Abstract: An antimicrobial filter media, which includes a non-woven fabric; and an antimicrobial agent bound to the nonwoven fabric by a binder, the antimicrobial agent including silver sodium zirconium hydrogenphosphate and thiabendazole, and the silver sodium zirconium hydrogenphosphate and the thiabendazole are employed at a weight ratio of 1:1.5 to 1.5:1, to an air cleaner including the same, and to a process for preparing the same. The antimicrobial filter media includes silver sodium zirconium hydrogenphosphate and thiabendazole, as an antimicrobial agent, at a specific weight ratio. As a result, it is possible to effectively filter harmful microorganisms to supply purified air, to have excellent antibacterial, antiviral, and antifungal properties at the same time, and to further enhance the durability and lifespan characteristics by virtue of excellent filter damage prevention effect.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; and signal electrodes, power electrodes, and ground electrodes disposed on the first surface, wherein the signal electrodes, the power electrodes, and the ground electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

Abstract: There is provided a space transformer for a probe card, including: a substrate having a first surface and a second; a plurality of first pads formed on the first surface to be spaced apart from each other and connected to a printed circuit board of a probe card; a plurality of second pads formed on the second surface in positions corresponding to those of the first pads and receiving external electrical signals applied thereto; a plurality of via electrodes penetrating through the substrate and respectively connected to the plurality of first pads and the plurality of second pads formed in the positions corresponding to each other; a ground layer formed to cover the second surface and provided with a plurality of second pad exposure holes; and an insulating layer formed to cover the ground layer and the plurality of second pads.

Abstract: A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

Abstract: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased. Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

Abstract: A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

Abstract: There is provided an antenna module. The antenna module according to the present invention may include a patch antenna resonator formed on a surface of a dielectric substrate; and a surface wave-radiation resonator disposed to be separated from the patch antenna resonator, and formed to surround the patch antenna resonator so that signals from the patch antenna resonator are radiated. In this instance, the signals may flow on the surface of the dielectric substrate.

Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

Abstract: There are provided a multilayer wiring board and a method of manufacturing the same. The multilayer wiring board according to an aspect of the invention may include: a main body having a plurality of insulting layers stacked upon each other, including a first layer provided as an inner layer and a second layer provided as an outer layer; a first resistor provided on the first layer; and a second resistor provided on the second layer, connected in parallel with the first resistor, and having a smaller area than the first resistor. The multilayer wiring board obtains a target resistance value using the first and second resistors formed on the first and second layers. The second resistor, formed on the outer layer, can have a smaller area than the first resistor. Accordingly, the usable area of the outer layer is increased to thereby reduce the size of the multilayer wiring board.

Abstract: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased. Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.