Patents by Inventor Yoon-Jong Lee

Yoon-Jong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804215
    Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: October 13, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyun Lim, Sang Jong Lee, Chul Kyu Kim, Yoon Seok Seo
  • Publication number: 20200274213
    Abstract: The present application can provide a battery module, a method for manufacturing method the same and a thermally conductive material applied to the manufacturing method. The present application can provide a battery module having excellent output relative to volume and heat dissipation characteristics, with being manufactured in a simple process and at a low cost, a method for manufacturing the same, and a thermally conductive material applied to the manufacturing method.
    Type: Application
    Filed: May 1, 2020
    Publication date: August 27, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Yoon Gyung Cho, Eun Suk Park, Sang Min Park, Se Woo Yang, Seong Kyun Kang, Jae Hun Yang, Jae Min Lee, Kyung Yul Bae, Young Gil Kim, Gyu Jong Bae
  • Publication number: 20200219783
    Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.
    Type: Application
    Filed: March 17, 2020
    Publication date: July 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han KIM, Jae Hyun LIM, Yoon Seok SEO, Sang Jong LEE
  • Patent number: 10676863
    Abstract: Provided herein is an eco-friendly artificial leather for an interior of an automobile and a manufacturing method thereof. The eco-friendly product is manufactured using a method that is compatible with various environmental regulations such as reduction of greenhouse gas emissions. The artificial leather includes a bio urethane-containing skin surface layer which uses biomass-derived components extracted from vegetable components, a solvent-free bio urethane adhesive layer, and a bio fiber base layer. The layers are sequentially stacked to minimize the use of organic solvents and components that are harmful to the human body.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 9, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, BAIKSAN Co., Ltd., HYUNDAI DYMOS INC.
    Inventors: Gun Kang, Mi Jung Yun, Soon Joon Jung, Hye Min Lee, Yoon Jong Cha, Seong Deuk An, Seung Ho Cho, Jae Yong Ko, Jun Ho Song, Hye Rin Choi
  • Publication number: 20200176391
    Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.
    Type: Application
    Filed: May 21, 2019
    Publication date: June 4, 2020
    Inventors: Jae Hyun Lim, Sang Jong Lee, Chul Kyu Kim, Yoon Seok Seo
  • Publication number: 20200168558
    Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
    Type: Application
    Filed: June 6, 2019
    Publication date: May 28, 2020
    Inventors: Yoon Seok SEO, Dae Hyun PARK, Sang Jong LEE, Chul Kyu KIM, Jae Hyun LIM
  • Patent number: 10651236
    Abstract: A semiconductor device includes a substrate including a memory cell region and a logic region; a variable resistance memory device on the memory cell region; a logic device on the logic region; a first horizontal bit line extending in a horizontal direction on a surface of the substrate on the memory cell region and electrically connected to the variable resistance memory device; a second horizontal bit line extending in a horizontal direction on the surface of the substrate on the logic region and electrically connected to the logic device; and a vertical bit line electrically connected to the first horizontal bit line and the second horizontal bit line and extending perpendicular to the surface of the substrate.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: May 12, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kil-ho Lee, Yoon-jong Song, Gwan-hyeob Koh
  • Publication number: 20200144573
    Abstract: The present application can provide a battery module, a manufacturing method thereof, and a resin composition applied to the manufacturing method. The present application can provide a battery module having excellent power relative to volume, while being manufactured in a simple process and at a low cost, a manufacturing method thereof, and a resin composition applied to the manufacturing method.
    Type: Application
    Filed: August 27, 2019
    Publication date: May 7, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Eun Suk Park, Yoon Gyung Cho, Sang Min Park, Se Woo Yang, Jae Hun Yang, Kyung Su Oh, Jae Min Lee, Young Gil Kim, Gyu Jong Bae, Kyoung Bin Im
  • Patent number: 10643956
    Abstract: A semiconductor package includes: a frame having first and second through-holes spaced apart from each other; passive components disposed in the first through-hole; a semiconductor chip disposed in the second through-hole and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface; a first encapsulant covering at least portions of the passive components and filling at least portions of the first through-hole; a second encapsulant covering at least portions of the semiconductor chip and filling at least portions of the second through-hole; and a connection structure disposed on the frame, the passive components, and the active surface of the semiconductor chip and including wiring layers electrically connected to the passive components and the connection pads of the semiconductor chip. The second encapsulant has a higher electromagnetic wave absorption rate than that of the first encapsulant.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Joon Kim, Sang Jong Lee, Yoon Seok Seo
  • Patent number: 10615360
    Abstract: An organic light emitting element according to an example embodiment of the present disclosure includes: an anode and a cathode facing each other; an emission layer between the anode and the cathode; an electron transfer layer between the emission layer and the cathode; and a buffer layer between the cathode and the electron transfer layer, wherein the buffer layer includes an inorganic metal halide having p-type semiconductor characteristics.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: April 7, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Chan Kim, Won Jong Kim, Eung Do Kim, Dong Kyu Seo, Ji Hye Lee, Da Hea Im, Sang Hoon Yim, Yoon Hyeung Cho, Won Suk Han
  • Patent number: 10607914
    Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun Lim, Han Kim, Yoon Seok Seo, Sang Jong Lee
  • Patent number: 10585217
    Abstract: A mirror substrate includes a transparent substrate, a plurality of first mirror patterns arranged on the transparent substrate and spaced apart from each other, each of the first mirror patterns including a phase compensation layer and a first mirror layer sequentially stacked on the transparent substrate, and a second mirror layer disposed on the transparent substrate and between neighboring ones of the first mirror patterns, the second mirror layer having a second thickness less than a first thickness of the first mirror layer.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: March 10, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sang-Hoon Yim, Dong-Chan Kim, Won-Jong Kim, Eung-Do Kim, Dong-Kyu Seo, Ji-Hye Lee, Da-Hea Im, Yoon-Hyeung Cho, Won-Suk Han
  • Publication number: 20200013727
    Abstract: A semiconductor package includes: a frame having first and second through-holes spaced apart from each other; passive components disposed in the first through-hole; a semiconductor chip disposed in the second through-hole and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface; a first encapsulant covering at least portions of the passive components and filling at least portions of the first through-hole; a second encapsulant covering at least portions of the semiconductor chip and filling at least portions of the second through-hole; and a connection structure disposed on the frame, the passive components, and the active surface of the semiconductor chip and including wiring layers electrically connected to the passive components and the connection pads of the semiconductor chip. The second encapsulant has a higher electromagnetic wave absorption rate than that of the first encapsulant.
    Type: Application
    Filed: January 30, 2019
    Publication date: January 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Joon Kim, Sang Jong Lee, Yoon Seok Seo
  • Patent number: 10510975
    Abstract: A light emitting diode and a light emitting diode display, the light emitting diode including a first electrode; a second electrode overlapping the first electrode; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, wherein the electron injection layer includes a lanthanide element, an alkali meta first element, and a halogen second element, and wherein the first element and the second element are included in the electron injection layer in an amount of 1 vol % to 20 vol %, based on a total volume of a material including the lanthanide element, the first element, and the second element.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Chan Kim, Dong Hoon Kim, Won Jong Kim, Ji Young Moon, Dong Kyu Seo, Ji Hye Lee, Da Hea Im, Sang Hoon Yim, Yoon Hyeung Cho, Won Suk Han
  • Patent number: 10483327
    Abstract: A light-emitting diode includes a first electrode, a second electrode overlapping the first electrode, a first emission layer and a second emission layer provided between the first electrode and the second electrode, and a first charge generating layer provided between the first emission layer and the second emission layer, the first charge generating layer including a p-type charge generating layer and an n-type charge generating layer. The n-type charge generating layer may include an organic material and an inorganic material doped to the organic material, and the inorganic material may include a lanthanide metal or an alkali earth metal, and an alkali halide.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: November 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Chan Kim, Won Jong Kim, Ji Young Moon, Dong Kyu Seo, Myung Chul Yeo, Ji Hye Lee, Yoon Hyeung Cho
  • Patent number: 10418576
    Abstract: A light emitting diode including a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; and an electron transporting region positioned between the second electrode and the emission layer, wherein the electron transporting region includes a tellurium compound of a rare earth metal.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong Chan Kim, Ji Young Moon, Yeong Rong Park, Dong Kyu Seo, Myung Chul Yeo, Ji Hye Lee, Hyung Seok Jang, Won Jong Kim, Yoon Hyeung Cho
  • Publication number: 20190273030
    Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.
    Type: Application
    Filed: August 23, 2018
    Publication date: September 5, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun LIM, Han KIM, Yoon Seok SEO, Sang Jong LEE
  • Publication number: 20190273220
    Abstract: An organic light emitting diode display includes: a substrate; an organic light emitting element on the substrate; and a capping layer on the organic light emitting element and including a high refraction layer formed of an inorganic material having a refractive index which is equal to or greater than about 1.7 and equal to or less than about 6.0, wherein the inorganic material includes at least one selected from CuI, thallium iodide (TlI), AgI, CdI2, HgI2, SnI2, PbI2, BiIa, ZnI2, MnI2, FeI2, CoI2, NiI2, aluminium iodide (AlI3), thorium(IV) iodide (ThI4), uranium triiodide (UI3), MgS, MgSe, MgTe, CaS, CaSe, CaTe, SrS, SrSe, SrTe, BaS, BaSe, BaTe, SnS, PbS, CdS, CaS, ZnS, ZnTe, PbTe, CdTe, SnSe, PbSe, CdSe, CuO, Cu2O, WO3, MoO3, SnO2, Nb2O5, Ag2O, CdO, CoO, Pr2O3, Bi2O3, Fe2O3, AlAs, GaAs, InAs, GaP, InP, AlP, AlSb, GaSb, and InSb.
    Type: Application
    Filed: May 20, 2019
    Publication date: September 5, 2019
    Inventors: Dong Chan KIM, Won Jong KIM, Eung Do KIM, Ji Hye LEE, Da Hea IM, Sang Hoon YIM, Yoon Hyeung CHO, Won Suk HAN
  • Patent number: 10403851
    Abstract: An organic light emitting diode display includes: a substrate; an organic light emitting element on the substrate; and a capping layer on the organic light emitting element and including a high refraction layer formed of an inorganic material having a refractive index which is equal to or greater than about 1.7 and equal to or less than about 6.0, wherein the inorganic material includes at least one selected from CuI, thallium iodide (TlI), AgI, CdI2, HgI2, SnI2, PbI2, BiI3, ZnI2, MnI2, FeI2, CoI2, NiI2, aluminum iodide (AlI3), thorium (IV) iodide (ThI4), uranium triiodide (UI3), MgS, MgSe, MgTe, CaS, CaSe, CaTe, SrS, SrSe, SrTe, BaS, BaSe, BaTe, SnS, PbS, CdS, CaS, ZnS, ZnTe, PbTe, CdTe, SnSe, PbSe, CdSe, CuO, Cu2O, WO3, MoO3, SnO2, Nb2O5, Ag2O, CdO, CoO, Pr2O3, Bi2O3, Fe2O3, AlAs, GaAs, InAs, GaP, InP, AlP, AlSb, GaSb, and InSb.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: September 3, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Chan Kim, Won Jong Kim, Eung Do Kim, Ji Hye Lee, Da Hea Im, Sang Hoon Yim, Yoon Hyeung Cho, Won Suk Han
  • Publication number: 20190252113
    Abstract: An electronic component includes a magnetic body including a resin and first magnetic powder and having a recess on a lower surface of the magnetic body, an internal coil portion embedded in the magnetic body, and external electrodes disposed on opposing ends of the magnetic body in a length direction of the magnetic body and connected to ends of the internal coil portion, wherein the first magnetic powder disposed on a surface of the recess may have a cut surface.
    Type: Application
    Filed: July 20, 2018
    Publication date: August 15, 2019
    Inventors: Jin Ho KU, Kwi Jong LEE, Yoon Soo LEE, Won Joong KIM