Abstract: An output circuit includes first and second output drivers. The first output driver is configured to transfer a first data signal directly to an output pad in synchronization with a clock signal. The second output driver is configured to transfer a second data signal directly to the output pad in synchronization with an inversion clock signal. The clock signal and the inversion clock enable multiplexing of the first data signal and the second data signal to provide a multiplexed output data signal.

Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

Abstract: A small signal receiver includes a first current adjustment circuit connected between a first power supply voltage terminal and a first node to provide current in response to a self-bias signal, a self-biased differential amplifier connected between the first node and a second node to compare an input signal with a reference voltage, provide the self-bias signal to a self-biasing node and output an output signal through an output node, and a second current adjustment circuit connected between the second node and a second power supply voltage terminal to sink current at the second node in response to the self-bias signal. The self-biased differential amplifier includes a swing stabilizing block connected between an input node to which the input signal is applied and the self-biasing node to stabilize the input signal compared with the reference voltage.

Abstract: An integrated circuit includes a data input such as a data pad for receiving an external data signal input and an on-die termination (ODT) information input for receiving ODT information from an external device. An ODT circuit selectively couples a termination resistor to the data pad based on the ODT information. An input buffer is coupled to the data pad for determining data that is input into the pad using a reference voltage. A reference voltage generator is coupled to the input buffer and generates the reference voltage on the basis of the ODT information.

Abstract: An input data alignment circuit includes a data sampler, a frequency divider, a polarity determination block, and a data alignment block. The data sampler provides a data sequence based on data serially input according to a data strobe signal. The frequency divider generates a data alignment signal based on a divided frequency of the data strobe signal. The polarity determination block determines a polarity of the data alignment signal and provides a control signal based on the determined polarity. The data alignment block aligns the data sequence in parallel according to data alignment signal and control signal and generates output data.

Abstract: Provided are a semiconductor memory device and a memory system including the same, which may calibrate a level of an output voltage in consideration of channel environment and a mismatch in on-die termination (ODT) resistance of a memory controller. The memory system includes a memory controller and a semiconductor memory device. The semiconductor memory device is configured to generate a reference voltage based on driving information of the memory controller, and calibrate an output voltage level based on a reference voltage when the semiconductor memory device is electrically connected to the memory controller.

Abstract: An input receiver circuit including a single-to-differential amplifier and a semiconductor device including the input receiver circuit are disclosed. The input receiver circuit includes a first stage amplifier unit and a second stage amplifier unit. The first stage amplifier unit amplifies a single input signal in a single-to-differential mode to generate a differential output signal, without using a reference voltage. The second stage amplifier unit amplifies the differential output signal in a differential-to-single mode to generate a single output signal.

Abstract: An input data alignment circuit includes a data sampler, a frequency divider, a polarity determination block, and a data alignment block. The data sampler provides a data sequence based on data serially input according to a data strobe signal. The frequency divider generates a data alignment signal based on a divided frequency of the data strobe signal. The polarity determination block determines a polarity of the data alignment signal and provides a control signal based on the determined polarity. The data alignment block aligns the data sequence in parallel according to data alignment signal and control signal and generates output data.

Abstract: An output circuit includes first and second output drivers. The first output driver is configured to transfer a first data signal directly to an output pad in synchronization with a clock signal. The second output driver is configured to transfer a second data signal directly to the output pad in synchronization with an inversion clock signal. The clock signal and the inversion clock enable multiplexing of the first data signal and the second data signal to provide a multiplexed output data signal.

Abstract: An integrated circuit includes a data input such as a data pad for receiving an external data signal input and an on-die termination (ODT) information input for receiving ODT information from an external device. An ODT circuit selectively couples a termination resistor to the data pad based on the ODT information. An input buffer is coupled to the data pad for determining data that is input into the pad using a reference voltage. A reference voltage generator is coupled to the input buffer and generates the reference voltage on the basis of the ODT information.

Abstract: A semiconductor memory device has a clock input buffer that is turned ‘on’ or ‘off’ in response to a first control signal. The clock input buffer is configured to buffer an external clock signal in order to output a buffered clock signal. The memory device further includes an internal clock generator that is configured to generate an internal clock signal in response to the buffered clock signal. The generation of the internal clock signal is started in response to a second control signal.

Abstract: An input receiver circuit including a single-to-differential amplifier and a semiconductor device including the input receiver circuit are disclosed. The input receiver circuit includes a first stage amplifier unit and a second stage amplifier unit. The first stage amplifier unit amplifies a single input signal in a single-to-differential mode to generate a differential output signal, without using a reference voltage. The second stage amplifier unit amplifies the differential output signal in a differential-to-single mode to generate a single output signal.

Abstract: Provided are a semiconductor memory device and a memory system including the same, which may calibrate a level of an output voltage in consideration of channel environment and a mismatch in on-die termination (ODT) resistance of a memory controller. The memory system includes a memory controller and a semiconductor memory device. The semiconductor memory device is configured to generate a reference voltage based on driving information of the memory controller, and calibrate an output voltage level based on a reference voltage when the semiconductor memory device is electrically connected to the memory controller.