Abstract: A control apparatus of an engine having a turbocharger may include the engine generating power by combustion of a fuel, the turbocharger including a turbine operated by exhaust gas of the engine and a compressor connected to the turbine by a rotating shaft, and thus supercharging air to a combustion chamber provided in the engine by the compressor, a detecting sensor detecting pre-ignition in the combustion chamber of the engine, and a controller controlling supercharging pressure supplied to the combustion chamber by using a required torque, ignition timing of the combustion chamber, and an air-fuel ratio, and thus controlling the pre-ignition in the combustion chamber, when the pre-ignition in the combustion chamber may be detected by the detecting sensor.

Abstract: A method for controlling an exhaust gas recirculation (EGR) system which is provided with an intake throttle valve and an EGR valve driven by a motor may include detecting an engine speed and an amount of intake air for each cylinder of an engine while the engine is operating, determining an amount of air flow supplied to the engine based on the engine speed and the amount of intake air for each cylinder, determining an equivalent cross-section of the EGR valve based on the amount of air flow, determining an opening angle of the EGR valve based on the engine speed, the amount of intake air for each cylinder, the amount of air flow, and the equivalent cross-section of the EGR valve, and controlling the EGR valve according to the opening angle of the EGR valve.

Abstract: A method of controlling an electric continuous variable valve timing apparatus improves starting performance of an engine by a simplified phase control for the camshaft. The method, in which intake and exhaust timing of an engine is changed in accordance with a phase of the camshaft, may include: determining whether starting off of the engine is required during driving; recognizing a target phase of the camshaft for next starting of the engine; controlling the phase of the camshaft so that the intake timing of the engine is advanced in accordance with the target phase; and ending the phase control of the camshaft in accordance with a state of the engine or the camshaft.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: An engine cooling system may include a main intake line for supplying external air to an intake manifold attached to an engine including a cylinder block and a cylinder head, a supplementary intake line branched from one side of the main intake line and joined to the other side of the main intake line, an intake route control valve in the main intake line, a main exhaust line for flowing exhaust gas from an exhaust manifold, an exhaust route control valve in the main exhaust line, a turbocharger, an intercooler mounted to the supplementary intake line on a downstream side of the turbocharger, an EGR cooler branched from the exhaust manifold for recirculating the exhaust gas and provided in an EGR line connected to the main intake line; and a cooling line for flowing a coolant supplied from a water pump to cool the EGR cooler, the exhaust route control valve and/or the turbine housing of the turbocharger.

Abstract: An control apparatus and method for an engine having a turbocharger may include determining a load condition of the engine by a controller, and opening and closing an intake valve, a throttle valve, and a wastegate valve by the controller according to the load condition of the engine, where a combustion chamber generates power by combusting a fuel, an intake valve adjusts an air/fuel mixed gas flowed into the combustion chamber, a continuously variable valve timing apparatus advances or retards an opening/closing timing of the intake valve, a turbocharger having a turbine and a compressor compressing air flowed into the combustion chamber, a throttle valve adjusting air supplied to the combustion chamber, a wastegate valve adjusting the exhaust gas flowed into the turbine, and a controller controlling the intake valve, the throttle valve, and the wastegate valve according to a load region of the engine.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: An engine system may include a first intake line configured to supply external air to an intake manifold mounted in a cylinder block of an engine, an intake bypass valve disposed on the first intake line, a second intake line configured to bypass the intake bypass valve, a first exhaust line, through which exhaust gas discharged from an exhaust manifold mounted in the cylinder block flows, an exhaust bypass valve disposed on the first exhaust line, a second exhaust line configured to bypass the exhaust bypass valve, a turbo charger operated by exhaust gas passing through the second exhaust line, and configured to pump intake air flowing in the second intake line, a controller configured to control the intake bypass valve and the exhaust bypass valve, and a turbine housing configured to surround a turbine of the turbo charger. The turbine housing may be made of a material the same as that of a cylinder head of the engine.

Abstract: A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

Abstract: In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad.

Abstract: An engine system may include a main intake line, a supplementary intake line branched from the main intake line and joined to the main intake line, an intake bypass valve mounted to the main intake line, a main exhaust line mounted to an exhaust manifold, a supplementary exhaust line branched from the exhaust manifold and joined to the main exhaust line, an exhaust bypass valve mounted to the main exhaust line and selectively opening the main exhaust line, a turbocharger disposed adjacent to the supplementary exhaust line and operated by exhaust gas passing through the supplementary exhaust line, and a control unit for controlling the intake bypass valve and the exhaust bypass valve depending on an operation condition, wherein the exhaust gas is re-circulated from an upstream side of the exhaust bypass valve to the main intake line passing through an EGR (Exhaust Gas Recirculation) cooler and an EGR valve.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second semiconductor die having a first surface facing downwardly to expose a bond pad and disposed to be offset with the first surface of the first semiconductor die, and an encapsulant encapsulating the first semiconductor die and the second semiconductor die together. Throughholes are disposed in the encapsulant adjacent the bond pad of the first semiconductor die and adjacent the bond pad of the second semiconductor die.

Abstract: A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

Abstract: An engine system having a turbocharger may include a main exhaust line branched from one side of an exhaust manifold and exhausting an exhaust gas from a combustion chamber, a supplementary exhaust line branched from another side of the exhaust manifold and exhausting the exhaust gas from the combustion chamber, a first catalyst device disposed in the main exhaust line and reducing toxic material included in the exhaust gas, a turbine of a turbocharger disposed in the supplementary exhaust line and operated by flow energy of the exhaust gas, a second catalyst device disposed in a downstream side of the turbine and reducing toxic material included in the exhaust gas; and an exhaust route control valve disposed in the main exhaust line and controlling a route of the exhaust gas.

Abstract: A method for controlling an exhaust gas recirculation (EGR) system which is provided with an intake throttle valve and an EGR valve driven by a motor may include detecting an engine speed and an amount of intake air for each cylinder of an engine while the engine is operating, determining an amount of air flow supplied to the engine based on the engine speed and the amount of intake air for each cylinder, determining an equivalent cross-section of the EGR valve based on the amount of air flow, determining an opening angle of the EGR valve based on the engine speed, the amount of intake air for each cylinder, the amount of air flow, and the equivalent cross-section of the EGR valve, and controlling the EGR valve according to the opening angle of the EGR valve.

Abstract: A supercharging system for an engine includes: a cylinder block forming a combustion chamber; an intake manifold connected to the cylinder block to supply ambient air thereto; an exhaust manifold collecting exhaust gas discharged from the combustion chamber and guiding the same to the environment; a third supercharge path connecting an inlet of the intake manifold to the exhaust manifold; and an electric supercharger supplying compressed air to the exhaust manifold through the third supercharge path. Responsiveness of an engine is enhanced and stabilization of the engine is promoted.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.