Abstract: The present invention provides a solar cell back sheet, including: a substrate layer; and a resin layer including a polyvinylidene fluoride (PVDF)-based polymer having a crystallinity of 50% or less, and a method of manufacturing the same. The solar cell back sheet is advantageous in that, since the drying temperature of the resin layer formed on at least one side of the substrate layer can be freely adjusted within the range of 250° C. or less, preferably, 200° C. or less, there can be improvements in the optimum conditions for obtaining optimum physical properties, minimization of the thermal deformation of the substrate layer, and the production cost and productivity of the solar cell back sheet.

Abstract: The present invention relates to polymer-silicon composite particles using silicon having high energy density, a method of making the same, an anode and a lithium secondary battery including the same. The silicon having high energy density is used as an anode active material to provide a lithium secondary battery having large capacity. Silicon-polymer composite particles having a metal plated on the surface thereof are provided to solve the problem that silicon has low electrical conductivity and a method of preparing the same is provided to produce an electrode having improved electrical conductivity. Furthermore, silicon-polymer composite particles having a metal coated on the surface thereof through electroless plating are prepared and an electrode is formed using the silicon-polymer composite particles.

Abstract: The present invention relates to a halogen-free flame-retardant resin composition and a prepreg and a copper clad laminate using the same. The present invention provides a halogen-free flame-retardant resin composition comprising a polyphosphate compound as phosphorus-based flame retardant and a prepreg and a copper clad laminate using the same. The resin composition of the present invention has superior flame retardancy without using a halogen-based flame retardant. Also, because it has superior heat resistance, a high glass transition temperature (Tg), good copper peeling strength and superior lead heat resistance after moisture absorption, it can be utilized in a copper clad laminate for printed circuit boards, etc.