Patents by Inventor Yoon M. Lee

Yoon M. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5316709
    Abstract: A manufacturing method is provided from manufacturing a dipper stick having a box shaped structure including an outer casing member formed of a high strength polymeric composite materials, an inner filler comprising polyurethane foam and disposed inside the outer casing member in order to be integrated with the outer casing member, and a plurality of bushing holders made of polymeric composite material and disposed at respective connecting portions of the box shaped structure in order to be integrated with the box shaped structure. The dipper stick is configured to be connected at the respective connecting portions to a bucket, a boom, dipper and bucket cylinders and a link, respectively.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: May 31, 1994
    Assignee: Samsung Heavy Industries Co., Ltd.
    Inventors: Jae I. Ko, Jae W. Lee, Yoon M. Lee, En J. Jean, Chun K. Kim, Jin Kim
  • Patent number: 5245770
    Abstract: A high strength polymeric composite material dipper stick which comprises a structure including an outer casing member formed of high strength polymeric composite materials, an inner filler comprising polyurethane foam disposed inside the outer casing member in order to be integrated with the outer casing member, and a plurality of bushing holders made of polymeric composite material and disposed at connecting portions of the structure in order to be integrated with said structure. The present invention provides weight reduction of about 50%-60% in comparison with a conventional structural steel dipper stick, and also about 6.8%-13.9% in comparison with the conventional structural steel dipper stick on the basis of weight ratio of excavated earth.
    Type: Grant
    Filed: July 10, 1991
    Date of Patent: September 21, 1993
    Assignee: Samsung Heavy Industries, Co., Ltd.
    Inventors: Jae I. Ko, Jae W. Lee, Yoon M. Lee, En J. Jean, Chun K. Kim, Jin Kim