Abstract: Disclosed is a thermoelectric material including a Sn-chalcogen-based compound, wherein the Sn is doped with a first dopant element comprising a transition metal element or a p-type metalloid element. Further, disclosed are thermoelectric module and thermoelectric apparatus, comprising the thermoelectric material.

Abstract: Disclosed is a thermoelectric material including a Sn-chalcogen-based compound, wherein the Sn is doped with a first dopant element comprising a transition metal element or a p-type metalloid element. Further, disclosed are thermoelectric module and thermoelectric apparatus, comprising the thermoelectric material.

Abstract: A test system for an integrated circuit chip, protects a circuit board from frost during low temperature testing. The test system comprises sealing means capable of removably attaching to a second surface of the test circuit board and for sealing a portion of the second surface to isolate the portion of the second surface of the test circuit board from ambient air. In this manner, the sealing unit prevents generation of frost at the solder junction portion of the test circuit, which would otherwise lead to leakage failures during test.

Abstract: The integrated circuit teat system and method prevent the occurrence of frost under a very low temperature environment during the exchange of integrated circuits under environmental testing and allows for the continuous testing thereof. The integrated circuit test system comprises a test chamber, a portion of which is adapted to interface with a tester having a circuit panel. An auxiliary chamber is adjacent the test chamber, the auxiliary chamber including a first door between the auxiliary chamber and the test chamber, the auxiliary chamber further including a second door between the auxiliary chamber and an external region, the auxiliary chamber for receiving a sample prior to and following a test. A transfer unit is also in the chamber, for transferring the sample between the test chamber and the auxiliary chamber through the first door. Accordingly, the time consumed during the exchange of testing samples is shortened.

Abstract: The integrated circuit test system and method prevent the occurrence of frost under a very low temperature environment during the exchange of integrated circuits under environmental testing and allows for the continuous testing thereof. The integrated circuit test system comprises a test chamber, a portion of which is adapted to interface with a tester having a circuit panel. An auxiliary chamber is adjacent the test chamber, the auxiliary chamber including a first door between the auxiliary chamber and the test chamber, the auxiliary chamber further including a second door between the auxiliary chamber and an external region, the auxiliary chamber for receiving a sample prior to and following a test. A transfer unit is also in the chamber, for transferring the sample between the test chamber and the auxiliary chamber through the first door. Accordingly, the time consumed during the exchange of testing samples is shortened.

Abstract: A test system for an integrated circuit chip, protects a circuit board from frost during low temperature testing. The test system comprises sealing means capable of removably attaching to a second surface of the test circuit board and for sealing a portion of the second surface to isolate the portion of the second surface of the test circuit board from ambient air. In this manner, the sealing unit prevents generation of frost at the solder junction portion of the test circuit, which would otherwise lead to leakage failures during test.