Abstract: According to one embodiment of the present invention, a method for dismantling a solar cell module for recycling comprises the steps of: providing a silicon solar cell module in which a silicon solar cell element and one side of glass are bonded together by a sealing agent and a transparent conductive material layer is coated between the side of the glass and the sealing agent; applying a high voltage between the transparent conductive material layer and the other side of the glass; and separating the glass and sealing agent by exposing the silicon solar cell module having the transparent conductive material layer discolored by application of the high voltage to a moisture environment.

Abstract: According to one embodiment of the present invention, a method for dismantling a solar cell module for recycling comprises the steps of: providing a silicon solar cell module in which a silicon solar cell element and one side of glass are bonded together by a sealing agent and a transparent conductive material layer is coated between the side of the glass and the sealing agent; applying a high voltage between the transparent conductive material layer and the other side of the glass; and separating the glass and sealing agent by exposing the silicon solar cell module having the transparent conductive material layer discolored by application of the high voltage to a moisture environment.

Abstract: A junction box connected to a photoelectric converter and including a body with a diode. The body includes first parts that are parallel to each other, a second part connecting ends of the first parts, and a bridge connecting the first parts. The diode is in the bridge, and the second part is spaced from the bridge to form an opening.

Abstract: A sealing member according to an exemplary embodiment of the present invention includes a first plate having a predetermined width with a plate shape, and a second plate with a plate shape connected to both ends of the first plate, wherein the first plate and the second plate have the same plate shape and form a closed line.

Abstract: A photoelectric device includes: a semiconductor substrate including monocrystalline silicon and has first and second surfaces that are opposite to each other; a doping unit formed on the first surface of the semiconductor substrate; and an insulating layer that is formed between the doping unit and the second surface of the semiconductor substrate, wherein the doping unit includes: a first semiconductor layer including a first dopant doped in the monocrystalline silicon; and a second semiconductor layer including a second dopant doped in the monocrystalline silicon.

Abstract: A method of fabricating a solar cell includes forming an emitter layer of a second conductive type on a front surface and a back surface of a substrate of a first conductive type opposite to the second conductive type, forming an anti-reflection layer on the front surface of the substrate, partially removing the anti-reflection layer and the emitter layer to form an isolation groove dividing the emitter layer into a plurality of regions, removing a portion of the emitter layer formed on the back surface of the substrate, and forming a passivation layer covering the isolation groove and the back surface of the substrate.

Abstract: A method for manufacturing a solar cell is presented. The method includes: forming an amorphous silicon layer on a first surface of a light absorbing layer; doping the amorphous silicon layer with a dopant; forming a dopant layer by diffusing the dopant into the amorphous silicon layer with a laser; forming a semiconductor layer by removing the dopant that remains outside the dopant layer; etching the surface of the semiconductor layer by using an etchant; forming a first electrode on the semiconductor layer; and forming a second electrode on a second surface of the light absorbing layer.

Abstract: Method of manufacturing a photovoltaic device and a photovoltaic device manufactured by using the method. The method includes forming a first conductive-type semiconductor layer using a first impurity on a semiconductor substrate, performing doping on a region of the first conductive-type semiconductor layer using a laser such that the region of the first conductive-type semiconductor layer has a higher concentration of the first impurity than a remaining portion of the first conductive-type semiconductor layer, performing edge isolation to form a groove portion at an edge portion of a rear surface of the semiconductor substrate, forming an antireflection layer on a front surface of the semiconductor substrate, forming a first metal electrode on the front surface of the semiconductor substrate, and forming a second metal electrode and a second conductive-type semiconductor layer including a second impurity that is different from the first impurity, on the rear surface of the semiconductor substrate.

Abstract: A method of manufacturing a solar cell includes preparing a base substrate having a first conductive type; diffusing an impurity having a second conductive type (opposite the first conductive type) into the base substrate to form an emitter layer having a first impurity concentration on the base substrate and a by-product layer on the emitter layer; irradiating a laser beam onto the emitter layer corresponding to a first region of the base substrate to form a front contact portion having a second impurity concentration higher than the first impurity concentration; irradiating the laser beam onto the by-product layer to remove the by-product layer corresponding to the first region; removing the by-product layer from an area outside of the first region; forming an anti-reflection layer on the base substrate; forming a front electrode on the anti-reflection layer corresponding to the first region; and forming a back electrode on the base substrate.

Abstract: A method of fabricating a solar cell includes forming an emitter layer of a second conductive type on a front surface and a back surface of a substrate of a first conductive type opposite to the second conductive type, forming an anti-reflection layer on the front surface of the substrate, partially removing the anti-reflection layer and the emitter layer to form an isolation groove dividing the emitter layer into a plurality of regions, removing a portion of the emitter layer formed on the back surface of the substrate, and forming a passivation layer covering the isolation groove and the back surface of the substrate.

Abstract: A method for manufacturing a solar cell is presented. The method includes: forming an amorphous silicon layer on a first surface of a light absorbing layer; doping the amorphous silicon layer with a dopant; forming a dopant layer by diffusing the dopant into the amorphous silicon layer with a laser; forming a semiconductor layer by removing the dopant that remains outside the dopant layer; etching the surface of the semiconductor layer by using an etchant; forming a first electrode on the semiconductor layer; and forming a second electrode on a second surface of the light absorbing layer.

Abstract: A solar cell is provided with a hetero-junction front structure (e.g., P/N or P/I/N) and is further provided in a back portion of thereof with a passivation layer having a plurality of openings defined therethrough. A BSF-forming binder material and a back face electrode are provided contacting the back surface and are fired to thereby bind the back face electrode to the structure and to form a BSF region extending from the openings of the passivation layer.

Abstract: In a method for implanting impurities into a substrate and a method for manufacturing a solar cell using the method, a substrate is dipped into a first solution including a first impurity, and a laser is irradiated to a first region of the substrate dipped into the first solution is irradiated with laser to implant a first dopant generated from the first impurity into the first region. Accordingly, the first dopant generated from the first impurity is implanted into the substrate at room temperature to improve reliability for implanting the first dopant.

Abstract: A method of manufacturing a solar cell includes providing a semiconductor substrate including a p-type layer and an n-type layer. A dielectric layer including aluminum oxynitride is disposed on one side of the semiconductor substrate. A first electrode is in electrical communication with the p-type layer of the semiconductor substrate. A second electrode is in electrical communication with the n-type layer of the semiconductor substrate. The disposing the dielectric layer comprises repeatedly forming an aluminum nitride layer and substituting a part of nitrogen of the aluminum nitride layer with oxygen.

Abstract: A compound image sensor includes a plurality of PN junction layers connected in parallel. The PN junction layers have different band gap energies, each corresponding to the absorption of light of blue, green, and red colors. The image sensor further includes oxide layers deposited between the PN junction layers to insulate the PN junction layers.