Abstract: A positive electrode active material precursor particle and/or a positive electrode active material particle according to one embodiment of the present disclosure include a core portion and a shell portion, the core portion includes nickel (Ni) and aluminum (Al), the shell portion includes cobalt (Co), a mol % value of the nickel (Ni) of the core portion is greater than a mol % value of nickel (Ni) of the shell portion, a mol % value of the aluminum (Al) of the core portion is greater than a mol % value of aluminum (Al) of the shell portion, and a mol % value of the cobalt (Co) of the shell portion is greater than a mol % value of cobalt (Co) of the core portion.

Abstract: A positive electrode active material precursor particle and/or a positive electrode active material particle according to one embodiment of the present disclosure include a core portion and a shell portion, the core portion includes nickel (Ni) and zirconium (Zr), the shell portion includes cobalt (Co), a mol % value of the nickel (Ni) of the core portion is greater than a mol % value of nickel (Ni) of the shell portion, a mol % value of the zirconium (Zr) of the core portion is greater than a mol % value of zirconium (Zr) of the shell portion, and a mol % value of the cobalt (Co) of the shell portion is greater than a mol % value of cobalt (Co) of the core portion.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.