Patents by Inventor Yoon Sun JANG

Yoon Sun JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970493
    Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 30, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Sung-Ku Choi, Yoon-Suk Lee, Sung-Wook Kwon, Kyung-Sun Kim, Jeong-Geun Kim, Jeong-Ah Kim, An-Na Moon, Sun-Young Park, Jun-Su Ban, Dong-Keun Song, Kyu-Sic Jang, Ju-Young Jung, Soo-Jin Lee
  • Publication number: 20230174834
    Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.
    Type: Application
    Filed: October 20, 2020
    Publication date: June 8, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Eun Bum KIM, Kwang Joo LEE, Jung Hak KIM, Ju Hyeon KIM, Yoon Sun JANG
  • Publication number: 20230051048
    Abstract: Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.
    Type: Application
    Filed: February 4, 2021
    Publication date: February 16, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Eun Bum KIM, Ju Hyeon KIM, Kwang Joo LEE, Jung Hak KIM, Yoon Sun JANG