Patents by Inventor Yoon Sung Na

Yoon Sung Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package and fabrication method thereof
    Patent number: 8735931
    Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: May 27, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
  • Light emitting diode package and fabrication method thereof
    Patent number: 8168453
    Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: May 1, 2012
    Assignee: Samsung LED Co., Ltd.
    Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
  • LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20110031526
    Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
    Type: Application
    Filed: October 19, 2010
    Publication date: February 10, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
  • LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20090197360
    Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 6, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Taeg HAN, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
  • Light emitting diode package and fabrication method thereof
    Publication number: 20070241362
    Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 18, 2007
    Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park