Patents by Inventor Yoon Tai KIM
Yoon Tai KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11876004Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: GrantFiled: April 21, 2022Date of Patent: January 16, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Sung Oh Cho, Yoon Tai Kim
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Publication number: 20230383414Abstract: Discussed is a deposition mask including a metal plate. The metal plate includes an alloy of nickel (Ni) and iron (Fe) having a plurality of through-holes. Each of the through-holes includes a first surface hole, a second surface hole opposite to the first surface hole, and a connecting part through which the first surface hole and the second surface hole communicate with each other. The metal plate includes a first outer portion, a second outer portion opposite to the first outer portion and a central portion between the first outer portion and the second outer portion. Nickel contents of the first outer portion and the second outer portion are greater than that of the central portion.Type: ApplicationFiled: August 15, 2023Publication date: November 30, 2023Applicant: LG INNOTEK CO., LTD.Inventors: Jee Heum PAIK, Yoon Tai KIM
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Patent number: 11781224Abstract: Discussed is a deposition mask including a metal plate having a first surface and a second surface opposite to the first surface, wherein the metal plate including an invar, wherein the metal plate includes a plurality of through-hole, wherein the through-hole includes a first surface hole forming in the first surface, a second surface hole forming in the second surface, and a connecting part through which the first surface hole and the second surface hole communicate with each other, and wherein an angle formed by a virtual line connecting the end of the connecting part and the end of the second surface hole, and a virtual line extending in a direction parallel to the second face from the end of the second surface hole is 30 to 60 degrees.Type: GrantFiled: December 3, 2021Date of Patent: October 10, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Jee Heum Paik, Yoon Tai Kim
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Patent number: 11476126Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: GrantFiled: November 19, 2020Date of Patent: October 18, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Sung Oh Cho, Yoon Tai Kim
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Publication number: 20220246445Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: ApplicationFiled: April 21, 2022Publication date: August 4, 2022Inventors: Sung Oh CHO, Yoon Tai KIM
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Patent number: 11293105Abstract: A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30 ?m or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer portion occupying an area corresponding to 20% or less of the total thickness of the metal plate from one surface thereof; a second outer portion occupying an area corresponding to 20% or less of the total thickness from the other surface opposite to the one surface; and a central portion except the first outer portion and the second outer portion, wherein the first outer portion and the second outer portion each have a larger nickel content than that of the central portion.Type: GrantFiled: March 8, 2018Date of Patent: April 5, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Jee Heum Paik, Yoon Tai Kim
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Publication number: 20220090270Abstract: Discussed is a deposition mask including a metal plate having a first surface and a second surface opposite to the first surface, wherein the metal plate including an invar, wherein the metal plate includes a plurality of through-hole, wherein the through-hole includes a first surface hole forming in the first surface, a second surface hole forming in the second surface, and a connecting part through which the first surface hole and the second surface hole communicate with each other, and wherein an angle formed by a virtual line connecting the end of the connecting part and the end of the second surface hole, and a virtual line extending in a direction parallel to the second face from the end of the second surface hole is 30 to 60 degrees.Type: ApplicationFiled: December 3, 2021Publication date: March 24, 2022Applicant: LG INNOTEK CO., LTD.Inventors: Jee Heum PAIK, Yoon Tai KIM
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Publication number: 20210140061Abstract: A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30 ?m or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer portion occupying an area corresponding to 20% or less of the total thickness of the metal plate from one surface thereof; a second outer portion occupying an area corresponding to 20% or less of the total thickness from the other surface opposite to the one surface; and a central portion except the first outer portion and the second outer portion, wherein the first outer portion and the second outer portion each have a larger nickel content than that of the central portion.Type: ApplicationFiled: March 8, 2018Publication date: May 13, 2021Applicant: LG INNOTEK CO., LTD.Inventors: Jee Heum PAIK, Yoon Tai KIM
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Publication number: 20210090902Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: ApplicationFiled: November 19, 2020Publication date: March 25, 2021Inventors: Sung Oh CHO, Yoon Tai KIM
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Patent number: 10872786Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: GrantFiled: June 24, 2020Date of Patent: December 22, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Sung Oh Cho, Yoon Tai Kim
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Publication number: 20200328093Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: ApplicationFiled: June 24, 2020Publication date: October 15, 2020Inventors: Sung Oh CHO, Yoon Tai KIM
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Patent number: 10734248Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: GrantFiled: October 24, 2019Date of Patent: August 4, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Sung Oh Cho, Yoon Tai Kim
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Publication number: 20200126811Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: ApplicationFiled: October 24, 2019Publication date: April 23, 2020Inventors: Sung Oh CHO, Yoon Tai KIM
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Patent number: 10490421Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: GrantFiled: April 24, 2019Date of Patent: November 26, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Sung Oh Cho, Yoon Tai Kim
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Publication number: 20190252210Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: ApplicationFiled: April 24, 2019Publication date: August 15, 2019Inventors: SUNG OH CHO, YOON TAI KIM
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Patent number: 10347507Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: GrantFiled: September 28, 2018Date of Patent: July 9, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Sung Oh Cho, Yoon Tai Kim
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Publication number: 20190103288Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.Type: ApplicationFiled: September 28, 2018Publication date: April 4, 2019Inventors: SUNG OH CHO, YOON TAI KIM
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Patent number: 9817497Abstract: A touch window includes a substrate, and an electrode part on the substrate. The sensing electrode includes a base substrate formed with a pattern part, and an electrode layer on the pattern part, where the electrode layer has a thickness in a range of 0.03 ?m to 3 ?m.Type: GrantFiled: July 1, 2015Date of Patent: November 14, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Yoon Tai Kim, Hyung Mook Oh, Kweon Jin Lee, Soo Hong Kim
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Publication number: 20160004340Abstract: A touch window includes a substrate, and an electrode part on the substrate. The sensing electrode includes a base substrate formed with a pattern part, and an electrode layer on the pattern part, where the electrode layer has a thickness in a range of 0.03 ?m to 3 ?m.Type: ApplicationFiled: July 1, 2015Publication date: January 7, 2016Inventors: Yoon Tai KIM, Hyung Mook OH, Kweon Jin LEE, Soo Hong KIM