Abstract: Provided are a negative electrode active material including a three-dimensional composite. The three-dimensional composite includes secondary particles containing a silicon carbide-based (SiCx, 0<x?1) nanosheet having a bent portion and amorphous carbon. Also provided are a method of producing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.

Abstract: An electrocardiogram (ECG) measurement device for a vehicle is provided. The ECG measurement device includes an impedance compensator that corresponds to an electrode in contact with a body of a driver and configured to compensate an impedance of each of electrode signals received from the electrode. An electrode selector sequentially selects the electrode signals in response to receiving the electrode signals from the electrode. A differential amplifier differentially amplifies the electrode signals. In particular, each electrode signal has the compensated impedance. Additionally, a signal quality evaluator evaluates quality of an ECG signal output from the differential amplifier and a compensation controller then adjusts an impedance compensation value of each of the impedance compensators as a result of evaluating the quality of the ECG signal.

Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a radome comprising a first locking unit and a sealing protrusion formed along at least one side end, a lower case formed along at least one side end and including a sealing protrusion groove which is configured to receive at least part of the sealing protrusion and a second locking unit, and a fastener which is fastened to the first locking unit and the second locking unit to fix the lower case and the radome.

Abstract: An aluminum alloy includes 6 to 8.5 wt % of magnesium (Mg), 4 to 6 wt % of silicon (Si), 0.4 to 0.8 wt % of iron (Fe), 0.2 to 0.5 wt % of manganese (Mn), 0.01 to 0.1 wt % of copper (Cu), 0.05 to 0.15 wt % of titanium (Ti), and the remainder being aluminum (Al), and may be in use for die-casting electronic components or communication components which require weight reduction and high corrosion resistance.

Abstract: An aluminum alloy includes 6 to 8.5 wt % of magnesium (Mg), 4 to 6 wt % of silicon (Si), 0.4 to 0.8 wt % of iron (Fe), 0.2 to 0.5 wt % of manganese (Mn), 0.01 to 0.1 wt % of copper (Cu), 0.05 to 0.15 wt % of titanium (Ti), and the remainder being aluminum (Al), and may be in use for die-casting electronic components or communication components which require weight reduction and high corrosion resistance.

Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.

Abstract: A communication box includes a body having walls defining sides. One side of the box is open and the wall at the open side of the body has a thickness of 0.5 mm to 2.5 mm. A cover seals the open side of the body. In a communication box in which the body and the cover are coupled to each other using screws, the thickness of the walls where the screws are not present is reduced, making it possible to increase internal capacity of the communication box while maintaining the outer size. Thus, the weight of a communication part is reduced, internal space of the communication box is effectively utilized, and characteristics of the communication box are improved.

Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.

Abstract: A signal process apparatus of the present invention is capable of shifting phases of signals inputted thereto and attenuating the signals, simultaneously. The signal process apparatus includes a dielectric member provided with a first and a second portions, a plurality of transmission lines positioned opposite the dielectric member for transmitting the signals and means for rotating the dielectric member to an axis perpendicular to a surface of the dielectric member which is parallel to the transmission lines. In the signal process apparatus, a dielectric constant of the first portion is different from that of the second portion. Each of the signals is inputted to a corresponding transmission line. After each of the signals is passing through the corresponding transmission line, it has a phase shifted by rotating the dielectric member.

Abstract: A signal process apparatus of the present invention is capable of shifting phases of signals inputted thereto and attenuating the signals, simultaneously. The signal process apparatus includes a dielectric member provided with a first and a second portions, a plurality of transmission lines positioned opposite the dielectric member for transmitting the signals and means for rotating the dielectric member to an axis perpendicular to a surface of the dielectric member which is parallel to the transmission lines. In the signal process apparatus, a dielectric constant of the first portion is different from that of the second portion. Each of the signals is inputted to a corresponding transmission line. After each of the signals is passing through the corresponding transmission line, it has a phase shifted by rotating the dielectric member.