Patents by Inventor Yoona PARK

Yoona PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12148571
    Abstract: A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: November 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: SoEun Choi, KangHa Lee, BeomSuk Kang, JinSoo Park, YoonA Park
  • Publication number: 20240239817
    Abstract: Disclosed are a metal oxide thin film precursor represented by Chemical Formula 1, a method of fabricating a metal oxide thin film using the same, and a semiconductor device including the metal oxide thin film. The definition of Chemical Formula 1 is as described in the detailed description.
    Type: Application
    Filed: November 30, 2023
    Publication date: July 18, 2024
    Inventors: Jongwook PARK, Woojin JEON, Sunwoo PARK, Hayoon LEE, Sang Wook PARK, Yoona CHOI, Yeong Jae HEO
  • Publication number: 20240186069
    Abstract: An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.
    Type: Application
    Filed: September 19, 2023
    Publication date: June 6, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha LEE, Jin Soo PARK, Yoona PARK, So Eun CHOI, Eun Byeol CHOI, Chul Seung LEE
  • Publication number: 20240177934
    Abstract: A multilayer electronic component, in which a first external electrode may include a 1-2-th electrode layer including glass, and a 1-3-th electrode layer disposed on the first and second surfaces and a second external electrode may include a 2-2-th electrode layer including glass, and a 2-3-th electrode layer disposed on the first and second surfaces. In cross sections of the first and second external electrodes in the first and second directions, when an area fraction occupied by glass in the 1-2-th electrode layer is S1-2, an area fraction occupied by glass in the 1-3-th electrode layer is S1-3, an area fraction occupied by glass in the 2-2-th electrode layer is S2-2, and an area fraction occupied by glass in the 2-3-th electrode layer is S2-3, S1-2?15%, S1-2?S1-3, S2-2?15%, S2-2>S2-3 are satisfied, thereby preventing cracks and improving moisture resistance reliability.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoona PARK, Ji Hye HAN, Kangha LEE, Chul Seung LEE
  • Publication number: 20240177929
    Abstract: In an embodiment of the present disclosure, among a plurality of crystal grains included in first electrode layers, crystal grains disposed on an end of the dielectric layer in the second direction and in contact with the second electrode layers are defined as first crystal grains and crystal grains disposed on ends of the internal electrodes in the second direction and in contact with the second electrode layers are defined as second crystal grains, and a growth direction of the first crystal grains and a growth direction of the second crystal grains may be adjusted, so that bonding force between the first electrode layers and the body may be improved.
    Type: Application
    Filed: September 28, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha Lee, Yoona Park, Jin Hyung Lim, Chul Seung Lee
  • Publication number: 20240177933
    Abstract: A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.
    Type: Application
    Filed: September 29, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha LEE, Yoona PARK, So Eun CHOI, Eun Byeol CHOI, Chul Seung LEE
  • Publication number: 20240079182
    Abstract: A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a corner of the body and connected to the base electrode layer, a conductive resin layer disposed on the intermediate electrode layer, and a plating layer disposed on the conductive resin layer. The intermediate electrode layer may be in contact with the plating layer on the corner of the body to prevent an increase in ESR while preventing cracks due to mounting through the conductive resin layer.
    Type: Application
    Filed: July 19, 2023
    Publication date: March 7, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoona Park, Kangha Lee, Hye Young Choi, Dong Ha Kang, Chul Seung Lee
  • Publication number: 20230282420
    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in the first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, a first external electrode including a first base electrode layer including glass and Ni and disposed on the third surface, a first intermediate electrode layer including an alloy containing Sn and Ni and disposed on the first base electrode layer, and a first conductive resin layer including a resin and a metal and disposed on the first intermediate electrode layer and extending to the first and second surfaces, a second external electrode including a second base electrode layer disposed on the fourth surface, a second intermediate electrode layer disposed on the second base electrode layer, and a second conductive resin layer disposed on the second intermediate electrode layer.
    Type: Application
    Filed: January 4, 2023
    Publication date: September 7, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha Lee, Yoona Park, Jinsoo Park, Wookyung Sung, Eunme Park, Jung Min Kim, Ji Hye Han, Jong Ho Lee
  • Publication number: 20230215655
    Abstract: An electronic component includes: a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a connection portion on the third surface, and first and third band portions respectively on the first and second surfaces; a second external electrode including a connection portion on the fourth surface, and second and fourth band portions respectively on the first and second surfaces; an insulating layer disposed on the connection portions, and covering the second surface and the third and fourth band portions; plating layers respectively disposed on the first and second band portions; and first and second additional electrode layers respectively disposed between the connection portion and the third surface and between the connection portion and the fourth surface. The first or second external electrode includes copper. The first or second additional electrode layer includes one of nickel and an alloy of nickel.
    Type: Application
    Filed: September 13, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: YoonA PARK, KangHa LEE, Myung Jun PARK, WooKyung SUNG, JinSoo PARK, SoEun CHOI
  • Publication number: 20230215638
    Abstract: A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).
    Type: Application
    Filed: September 26, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: SoEun CHOI, KangHa LEE, BeomSuk KANG, JinSoo PARK, YoonA PARK
  • Publication number: 20220392707
    Abstract: A multilayer capacitor includes a capacitor body including an active region having a dielectric layer, and first and second internal electrodes, and an upper cover region and a lower cover region respectively disposed above and below the active region, and including first to sixth surfaces; and first and second external electrodes disposed on both end portions of the capacitor body in the second direction, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes include first and second conductive layers disposed on the third and fourth surfaces, respectively; first and second conductive resin layers disposed on the first and second conductive layers, respectively; and first and second plating layers disposed on the first and second conductive resin layers, respectively, and contacting the first and second conductive layers in the upper or lower cover region, respectively.
    Type: Application
    Filed: April 29, 2022
    Publication date: December 8, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha LEE, Yoona PARK, Jinsoo PARK, Eun-Jin KIM, Yeon Song KANG, Myung Jun PARK