Abstract: Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.

Abstract: A plasma processing apparatus includes; a chamber, a lower electrode disposed within the chamber and including a lower surface and an opposing upper surface configured to seat a wafer, an RF rod disposed on the lower surface of the lower electrode and extending in a vertical direction. The RF plate includes a first portion contacting the lower surface of the lower electrode, a second portion protruding from the first portion towards the RF rod, and a third portion extending from the second portion to connect the RF rod. A grounding electrode is spaced apart from the RF plate and at least partially surrounds a side wall of the RF rod and a side wall of the second portion of the RF plate. The grounding electrode includes a first grounding electrode facing each of the side wall of the RF rod and the second portion of the RF plate, and a second grounding electrode at least partially surrounding the first grounding electrode, and configured to horizontally rotate.

Abstract: A plasma processing apparatus includes; a chamber, a lower electrode disposed within the chamber and including a lower surface and an opposing upper surface configured to seat a wafer, an RF rod disposed on the lower surface of the lower electrode and extending in a vertical direction. The RF plate includes a first portion contacting the lower surface of the lower electrode, a second portion protruding from the first portion towards the RF rod, and a third portion extending from the second portion to connect the RF rod. A grounding electrode is spaced apart from the RF plate and at least partially surrounds a side wall of the RF rod and a side wall of the second portion of the RF plate. The grounding electrode includes a first grounding electrode facing each of the side wall of the RF rod and the second portion of the RF plate, and a second grounding electrode at least partially surrounding the first grounding electrode, and configured to horizontally rotate.

Abstract: A washing water supply apparatus for a dish washing machine which is capable of concurrently supplying washing water to both upper and lower spray arms or selectively supplying the washing water to either the upper spray arm or the lower spray arm based on the washing amount of dishes. The apparatus includes a casing for guiding washing water in a washing water flow path in order to convert a part of the washing water flow into a cross-flow, an orifice tube for increasing the flowing speed of the washing water introduced into the casing and discharging the same, a valve ball for opening/closing an orifice of the orifice tube, and movable in the interior of the casing in accordance with a flow direction of the washing water, and an actuator having a moving member for moving the valve ball toward the orifice.

Abstract: A pulsator with an improved structure having a punching function is used in a washing machine. The pulsator of the present invention is composed such that a rotating member has a guiding dimple formed on its upper end surface, and an elevating member has a guiding protrusion projected from the inner surface. According to this pulsator, non-symmetrical water flow and up-and-down water flow can be generated easily so that the entanglement of the washing articles can be minimized, and the washing is carried out effectively.