Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A package substrate includes a wiring substrate comprising an insulating layer, a first wiring layer, and a second wiring layer, wherein the first wiring layer comprises a first pad pattern, and the second wiring layer comprises a second pad pattern; a first passivation layer disposed on the insulating layer, and having a first opening portion passing through a region corresponding to at least a portion of the first pad pattern; a second passivation layer disposed on the insulating layer, and having a second opening portion passing through a region corresponding to at least a portion of the second pad pattern; and a reinforcing layer disposed on the second passivation layer, and having a through portion exposing the second opening portion. An upper surface of the first wiring layer is located in a position higher than a position of the lower surface of the insulating layer.

Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

Abstract: A package substrate includes a wiring substrate comprising an insulating layer, a first wiring layer, and a second wiring layer, wherein the first wiring layer comprises a first pad pattern, and the second wiring layer comprises a second pad pattern; a first passivation layer disposed on the insulating layer, and having a first opening portion passing through a region corresponding to at least a portion of the first pad pattern; a second passivation layer disposed on the insulating layer, and having a second opening portion passing through a region corresponding to at least a portion of the second pad pattern; and a reinforcing layer disposed on the second passivation layer, and having a through portion exposing the second opening portion. An upper surface of the first wiring layer is located in a position higher than a position of the lower surface of the insulating layer.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.

Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

Abstract: A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

Abstract: A printed circuit board includes a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate, and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being spaced apart from a side surface of the core part by a predetermined distance.

Abstract: A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.

Abstract: A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer.

Abstract: A method for manufacturing a multi-layer printed circuit board includes: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the second copper layer; laminating insulating films on top and bottom surfaces of the insulating layer on which the circuits have been formed; forming second bumps on one surface of a third copper layer and of a fourth copper layer at a predetermined interval; and stacking the third copper layer and fourth copper layer, provided with the second bumps, on the top and bottom surfaces of the insulating films.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer formed on the metal root layer.

Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.

Abstract: Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting a pillar disposed on an outermost insulating layer of the plurality of insulating layers.